Method of producing acceleration sensor chip package
First Claim
1. A method of producing an acceleration sensor chip package, comprising the steps of:
- preparing a semiconductor substrate having a plurality of acceleration sensors arranged in a matrix pattern, each of said acceleration sensors having an electrode pad and a movable structure disposed in an opening portion;
attaching a substrate to a lower surface of the semiconductor substrate;
forming a re-wiring layer extending on the semiconductor substrate outside the opening portions and having a plurality of wiring portions, each of said wiring portions having one end electrically connected to each of the electrode pads;
forming a plurality of outer terminals on the semiconductor substrate outside the opening portions, each of said outer terminals being connected to the other end of each of the wiring portions;
forming a plurality of conductive bumps connected to the electrode pads;
attaching a sensor control chip having a first surface and a second surface opposite to the first surface, said sensor control chip having sensor control electrode pads connected to the electrode pads;
forming a sealing portion for sealing the sensor control chip, the electrode pads, and the re-wiring layer such that the outer terminals are exposed; and
cutting the sealing portion, the semiconductor substrate, and the substrate situated between the acceleration sensors to obtain the acceleration sensor chip package as a piece.
1 Assignment
0 Petitions
Accused Products
Abstract
An acceleration sensor chip package includes an acceleration sensor chip; a sensor control chip; a re-wiring layer; an outer terminal; a sealing portion; and a substrate. The acceleration sensor chip includes a frame portion; a movable structure; a detection element; and an electrode pad electrically. The re-wiring layer has a wiring portion connected to the electrode pad. The electrode pad is electrically connected to a conductive bump. The sensor control chip has a sensor control electrode pad electrically connected to the conductive bump. The outer terminal is connected to the wiring portion and disposed in the outer region. The sealing portion seals the sensor control chip, the electrode pad, and the re-wiring layer, so that the movable structure is movable. The substrate is attached to the acceleration sensor chip to seal an opening portion.
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Citations
4 Claims
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1. A method of producing an acceleration sensor chip package, comprising the steps of:
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preparing a semiconductor substrate having a plurality of acceleration sensors arranged in a matrix pattern, each of said acceleration sensors having an electrode pad and a movable structure disposed in an opening portion; attaching a substrate to a lower surface of the semiconductor substrate; forming a re-wiring layer extending on the semiconductor substrate outside the opening portions and having a plurality of wiring portions, each of said wiring portions having one end electrically connected to each of the electrode pads; forming a plurality of outer terminals on the semiconductor substrate outside the opening portions, each of said outer terminals being connected to the other end of each of the wiring portions; forming a plurality of conductive bumps connected to the electrode pads; attaching a sensor control chip having a first surface and a second surface opposite to the first surface, said sensor control chip having sensor control electrode pads connected to the electrode pads; forming a sealing portion for sealing the sensor control chip, the electrode pads, and the re-wiring layer such that the outer terminals are exposed; and cutting the sealing portion, the semiconductor substrate, and the substrate situated between the acceleration sensors to obtain the acceleration sensor chip package as a piece. - View Dependent Claims (2)
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3. A method of producing an acceleration sensor chip package, comprising the steps of:
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preparing a semiconductor substrate having a plurality of acceleration sensors arranged in a matrix pattern in areas defined by scribe lines extending between the acceleration sensors and a plurality of chip through holes arranged on the scribe lines, each of said acceleration sensors having an electrode pad and a movable structure disposed in an opening portion; attaching a first substrate having a plurality of sensor control chips arranged in a matrix pattern to the semiconductor substrate, each of said sensor control chips including a first surface and a second surface opposite to the first surface so that the second surface is attached to a lower surface of the semiconductor substrate, each of said sensor control chips including a plurality of sensor control electrode pads exposed from the first surface to face the electrode pads, each of said sensor control chips including a plurality of control chip through holes to communicate with the chip through holes; filling the control chip through holes and the chip through holes with a conductive material to form side wiring portions each having a first end and a second end; forming upper wiring portions in regions between the scribe lines and the opening portion, each of said upper wiring portions having one end connected to each of the electrode pads and the other end connected to the first end of each of the side wiring portions; attaching a second substrate having a plurality of recess portions to the semiconductor substrate such that the recess portions are situated above the movable structures and cover the same; forming lower wiring portions extending on the first surfaces of the sensor control chips, each of said lower wiring portions having one end connected to the second end of each of the side wiring portions; forming outer terminals on the first surfaces of the sensor control chips, each of the outer terminals being connected to the other end of each of the lower wiring portions; forming a sealing portion for sealing the sensor control chips such that the outer terminals are exposed; cutting the sealing portion, the semiconductor substrate, and the second substrate into pieces along the scribe lines between the acceleration sensors; and cutting the side wiring portions to be exposed from side surfaces. - View Dependent Claims (4)
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Specification