Miniature actuator integration for liquid cooling

• US 20080135216A1
• Filed: 12/07/2006
• Published: 06/12/2008
• Est. Priority Date: 12/07/2006
• Status: Abandoned Application

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Yang, Wei, Zhang, Chunbo
• Application Number:
  US11/636,142
• Publication Number:
  US 20080135216A1
• Time in Patent Office: Days
• US Class Current: 165/104.33
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A device for cooling integrated circuits on circuit boards. A base placed proximate the element to be cooled contains an actuator that forces a cooling liquid through a plurality of channels that dissipate heat generated by the element. The base with the actuator, liquid and channels is sealed with a top. Preferred actuators are electric motors, and MEMS such as electrostatic actuators and piezoelectric actuators. The base has a large surface area relative to the thickness of the chamber The ratio of the surface area to thickness may range from about 40:1 to about 5:1.

Claims

1. A device for cooling elements that generate heat, comprising:

a base for defining a chamber, said base being adapted to be placed proximate the element to be cooled;

a coolant fluid in said chamber;

a micro/mini channel element in said chamber for directing flow of said coolant fluid through a plurality of channels or loops;

a miniature actuator integrated in said chamber for forcing said cooling fluid through said plurality of channels in said micro/mini channel element having a surface area to thereby dissipate heat generated by said element; and

a top for sealing said chamber and maintaining said coolant fluid inside said base.

2. The device of claim 1, wherein said coolant fluid is a liquid.

3. The device of claim 2, wherein said liquid is water.

4. The device of claim 1, wherein said base is thermally conductive metal.

5. The device of claim 1, wherein said actuator is an electric motor for operating in said fluid.

6. The device of claim 1, wherein said actuator is an electrostatic actuator.

7. The device of claim 1, wherein said actuator is a piezoelectric actuator.

8. The device of claim 1, wherein said element to be cooled is an integrated circuit chip.

9. The device of claim 1, wherein said base has a large surface area relative to the thickness of said chamber.

10. The device of claim 9, wherein the ratio of said surface area to thickness ranges from about 40:

1 to about 5;

1.

11. A device for cooling elements that generate heat, comprising:

base means for defining a chamber, said base means being adapted to be placed proximate the element to be cooled;

a coolant fluid in said chamber;

micro/mini channel element means in said chamber for directing flow of said coolant fluid through a plurality of channels in said micro channel element means;

miniature actuator means integrated in said chamber for forcing said cooling fluid through said plurality of channels in said micro/mini channel element means having a surface area to thereby dissipate heat generated by said element; and

top means for sealing said chamber and maintaining said coolant fluid inside said base means.

12. The device of claim 11, wherein said coolant fluid is a liquid.

13. The device of claim 12, wherein said liquid is water.

14. The device of claim 11, wherein said base means is formed from thermally conductive metal.

15. The device of claim 11, wherein said actuator means is an electric motor for operating in said fluid.

16. The device of claim 11, wherein said actuator means is an electrostatic actuator.

17. The device of claim 11, wherein said actuator means is a piezoelectric actuator.

18. The device of claim 11, wherein said element to be cooled is an integrated circuit chip.

19. The device of claim 11, wherein said base means has a large surface area relative to the thickness of said chamber.

20. The device of claim 19, wherein the ratio of said surface area to thickness ranges from about 40:

1 to about 5;

1.