Manufacturing Process For Producing Narrow Sensors
First Claim
1. An electrode assembly (100) for use in a transcutaneous electrochemical sensor comprising at least a first conducting layer (2), at least a second conducting layer (4) and at least a first dielectric layer (3) wherein that the first conducting layer (2) is deposited on a substrate (1) and that the first dielectric (3) layer is placed between the first (2) and the second conducting layer (4).
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Accused Products
Abstract
This application relates to electrode assemblies (100) for use in an electrochemical sensor, the electrode assembly comprising: a first conductive layer (2) comprising a first electrode surface (8) and a first contact area (11), a second conductive layer (4) comprising a second electrode surface (9) and a second contact area (12), and a first dielectric layer (3) where said first dielectric layer is adjacent to said first conductive layer, wherein said second conductive layer and said first dielectric layer do not cover at least a part of the first and at least a part of the second electrode surface and do not cover at least a part of the first and at least a part of the second contact area. It also relates to methods of manufacturing such electrode assemblies. In this way, modification of conventional 2D structures into sandwiched or 3D structures containing at least two separated conductive layers is provided by a sequential application of further layers constituting at least one dielectric layer and one further conducting layer to the original 2D structure. The dielectric layer may be applied first, followed by the application of a further electrical conducting layer. Alternatively the conventional 2D layer may be modified by lamination of a further 2D layer, thus forming a sandwiched structure.
44 Citations
42 Claims
- 1. An electrode assembly (100) for use in a transcutaneous electrochemical sensor comprising at least a first conducting layer (2), at least a second conducting layer (4) and at least a first dielectric layer (3) wherein that the first conducting layer (2) is deposited on a substrate (1) and that the first dielectric (3) layer is placed between the first (2) and the second conducting layer (4).
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33. A method of manufacturing an electrode assembly (100), the method comprising the steps of:
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applying a first conductive layer (2) to a dielectric substrate (1), the first conductive layer (2) comprising a first electrode surface (8) and a first contact area (11), applying a first dielectric layer (3) to said first conductive layer (2) so that said first electrode surface (8) and said first contact area (11) is not covered by said first dielectric layer (3), and applying a second conductive layer (4) to said first dielectric layer (3) so that said first electrode surface (8) and said first contact area (11) is not covered by said second conductive layer (4), said second conductive layer (4) comprising a second electrode surface (9) and a second contact area (12). - View Dependent Claims (34, 35, 36, 37, 41)
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38. A method of manufacturing an electrode assembly (100), the method comprising the steps of:
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applying a first conductive layer (2) to a dielectric substrate (1), applying a first polymer laminate (14) comprising at least two polymers to said dielectric substrate (1), applying a second conductive layer (4) to said first polymer laminate (14), and applying a second polymer laminate (15) comprising at least two polymers to said first conductive layer (2). - View Dependent Claims (39, 42)
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40. A method of manufacturing an electrode assembly, the method comprising the steps of:
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applying a first conductive layer (2) comprising a first electrode surface (8) and a first contact area (11), to a dielectric substrate (1) on a first side of the dielectric substrate (1), applying a second conductive layer (4) to a first dielectric layer (3), and applying the first dielectric layer (3) to said dielectric substrate (1) on a second side of the dielectric substrate (1).
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Specification