Lead frame of through-hole light emitting diode

• US 20080135993A1
• Filed: 03/09/2007
• Published: 06/12/2008
• Est. Priority Date: 12/08/2006
• Status: Abandoned Application

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Yu, Chin-Yin, Tzan, Shyh-Rong, Huang, Tien-Fu, Hu, Kuo-Chang
• Application Number:
  US11/716,457
• Publication Number:
  US 20080135993A1
• Time in Patent Office: Days
• US Class Current: 257/673
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A lead frame of a through-hole light emitting diode (LED) is used to carry an LED chip, and a lens is used to package the chip and a portion of the lead frame. The lead frame includes at least two leads. One lead is used to carry the chip and each of the leads is extended outward from the lens and has a positioning bump. The positioning bumps partially protrude from the lens, such that when the lead frame is disposed on a circuit board, the lead frame is positioned through the positioning bumps and aligns the lens to guide an optical axis of the through-hole LED, thereby achieving the purposes of convenient assembly, thinness, and a reduced thermal-conducting distance.

Claims

1. A lead frame of a through-hole light emitting diode (LED), used to carry an LED chip and electrically connected to a plurality of electrodes of the LED chip, wherein the LED chip and a portion of the lead frame are encapsulated in a lens, and the lens guides a light emitted from the LED chip, the lead frame of the LED comprising:

at least two leads, wherein a portion of the leads is encapsulated in the lens and a carrying portion is extended from one of the leads;

the carrying portion is encapsulated by the lens and carries the LED chip;

the electrodes of the LED chip are electrically connected to the leads, respectively;

each of the leads has a positioning bump;

the positioning bumps partially protrude from the lens to constitute a reference plane, and the reference plane forms a specific angle with a direction of guiding the light.

2. The lead frame of a through-hole LED as claimed in claim 1, wherein the reference plane is disposed outside of a surface of the lens.

3. The lead frame of a through-hole LED as claimed in claim 1, wherein the carrying portion has a spoon portion, for accommodating the LED chip.

4. The lead frame of a through-hole LED as claimed in claim 1, wherein the reference plane is perpendicular to the direction of guiding the light.

5. The lead frame of a through-hole LED as claimed in claim 1, wherein the reference plane forms an angle of 70 to 110°

with the direction of guiding the light.

6. The lead frame of a through-hole LED as claimed in claim 1, wherein structure of the lead frame comprises four leads disposed symmetrically and any two leads are electrically connected with each other.

7. The lead frame of a through-hole LED as claimed in claim 1, wherein sections of another ends of the leads opposite to the LED chip are convergent.

8. A lead support of a through-hole light emitting diode (LED), used to carry a plurality of LED chips and encapsulate the LED chips with a plurality of lenses, respectively, wherein edge lines of the encapsulation of the lens form a plurality of lens package lines on the lead support, the lead support of the through-hole LED comprising:

a plurality of lead frames, wherein each of the lead frames comprises at least two leads, a carrying portion is extended from one of the leads to carry the LED chip, each of the leads has a positioning bump, and at least one lens package line passes through the positioning bumps; and

a plurality of structures, connected to the lead frames to form the lead support of the through-hole LED.

9. The lead support of a through-hole LED as claimed in claim 8, wherein the carrying portion has a spoon portion, for accommodating the LED chip.

10. The lead support of a through-hole LED as claimed in claim 8, wherein sections of another ends of the leads opposite to the carrying portion are smaller than other portions.

11. The lead support of a through-hole LED as claimed in claim 8, wherein each of the lens package lines forms a closed area.

12. The lead support of a through-hole LED as claimed in claim 11, wherein distances between the positioning bumps penetrated by the same lens package line and the lens package line are same.