ELECTRONIC ELEMENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

• US 20080137270A1
• Filed: 12/07/2007
• Published: 06/12/2008
• Est. Priority Date: 12/12/2006
• Status: Active Grant

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Ishitani, Shinji, Higashi, Kazushi
• Granted Patent: US 8,077,447 B2
• Time in Patent Office: Days
• US Class Current: 361/679
• CPC Class Codes: B81B 2201/025 Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: Y10T 29/49 Method of mechanical manufacture

Abstract

An electronic element package includes a plate-like sensor substrate with a detector formed thereon, and a plate-like first cover substrate and a plate-like second cover substrate joined directly or indirectly to a top surface and a bottom surface, respectively, of the sensor substrate so that the sensor substrate is located between the first and second cover substrates, the sensor substrate including, a frame surrounding the detector via a space, beams joining the detector to the frame, and an electrode disposed on the frame and electrically connected to the detector, one of the first cover substrate and the second cover substrate having a through-hole which contacts an electrode. The electronic element package enables a reduction in thickness and offers improved reliability.

Claims

1. An electronic element package comprising a plate-like sensor substrate with a detector formed thereon, and a plate-like first cover substrate and a plate-like second cover substrate joined directly or indirectly to a top surface and a bottom surface, respectively, of the sensor substrate so that the sensor substrate is located between the first and second cover substrates,

the sensor substrate comprising:

at least a first detecting portion and a second detecting portion as the detector;

a frame surrounding the detector via a space;

at least two beams joining the detector to the frame; and

an electrode disposed on the frame and electrically connected to the detector,

one of the first cover substrate and the second cover substrate having a through-hole with an inner wall as an end surface which contacts at least a part of the electrode.

2. The electronic element package according to claim 1, wherein the electrode is disposed in an area surrounded by a partial side of the frame which is located opposite the detector via the space and an outer periphery of the frame.

3. The electronic element package according to claim 1, wherein recessed portions are formed in a surface of the cover substrates located opposite the sensor substrate and is positioned in association with the detecting portions.

4. The electronic element package according to claim 1, wherein the sensor substrate is formed thinner in a portion thereof occupied by the detector than in a periphery thereof.

5. A method of manufacturing an electronic element package comprising a plate-like sensor substrate with a detector formed thereon, and a plate-like first cover substrate and a plate-like second cover substrate joined directly or indirectly to a top surface and a bottom surface, respectively, of the sensor substrate so that the sensor substrate is located between the first and second cover substrates, the method comprising the steps of:

when producing the electronic element package, forming a junction wafer comprising a first wafer on which a plurality of the sensor substrates with the detectors formed thereon are mounted, and a second wafer and a third wafer on which a plurality of the first and second cover substrates, respectively, are mounted in association with the sensor substrates and which are jointed to a top surface and a bottom surface, respectively, of the first wafer so that the first wafer is located between the second and third wafers; and

cutting the junction wafer into electronic element packages.

6. An electronic element package comprising:

an element substrate on which an electronic element is formed, and a cover substrate, the element substrate and the cover substrate being joined together;

a bulkhead portion surrounding and sealing the electronic element in a gap between the element substrate and the cover substrate;

an introduction hole formed in the cover substrate in association with a first electrode on the element substrate, the introduction hole being shaped so as to have a diameter decreasing toward the element substrate; and

a second electrode formed on the cover substrate to close an element substrate-side end of the introduction hole, the first electrode and the second electrode abutting against each other.

7. The electronic element package according to claim 6, wherein a groove extending toward the element substrate is formed on an inner periphery of the introduction hole.

8. A method of mounting an electronic element package comprising an element substrate on which an electronic element is formed, and a cover substrate, the element substrate and the cover substrate being joined together, a bulkhead portion surrounding and sealing the electronic element in a gap between the element substrate and the cover substrate, and an introduction hole formed in the cover substrate in association with a first electrode on the element substrate, the introduction hole being shaped so as to have a diameter decreasing toward the element substrate, the method comprising the steps of:

when mounting the electronic element package on a land formed on a substrate, placing a conductive material on the land on the substrate at a mounting position; and

pressing the electronic element package against the substrate at the mounting position with the introduction hole located opposite the substrate to guide the conductive material placed on the land at the mounting position, toward the first electrode on the element substrate through the introduction hole of the electronic element package to electrically connect the land on the substrate to the electronic element on the element substrate via the conductive material.