DETECTION OF CLEARANCE OF POLYSILICON RESIDUE
First Claim
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1. A method of detecting an endpoint during polishing of polysilicon, comprising:
- polishing a substrate having polysilicon residue on an area of oxide; and
optically detecting clearance of the polysilicon residue.
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Abstract
During polishing of a substrate, polysilicon can be removed from a surface of the substrate. Detecting an endpoint during polishing of polysilicon can include polishing the substrate having a polysilicon residue on an area of oxide area and optically detecting clearance of the polysilicon residue.
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Citations
15 Claims
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1. A method of detecting an endpoint during polishing of polysilicon, comprising:
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polishing a substrate having polysilicon residue on an area of oxide; and optically detecting clearance of the polysilicon residue. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of detecting an endpoint, comprising:
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receiving a spectrum during polishing of a substrate having polysilicon residue on an oxide area; and optically detecting clearance of the polysilicon residue using the spectrum.
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9. A computer program product, tangibly stored on machine readable medium, the product comprising instructions operable to cause a processor to:
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receive a spectrum during polishing of a substrate having polysilicon residue on an oxide area; and detect clearance of the polysilicon residue from a spectrum. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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Specification