MINIATURIZED FEEDTHROUGH

• US 20080140148A1
• Filed: 11/30/2007
• Published: 06/12/2008
• Est. Priority Date: 11/30/2006
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Rogier, Receveur
• Granted Patent: US 9,132,268 B2
• Time in Patent Office: Days
• US Class Current: 607/36
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/3754 Feedthroughs

Abstract

Formation of a feedthrough in a substrate for use in an implantable medical device is presented. A substrate includes a first surface and a second surface, and a via that extends through the first and the second surfaces. A dielectric layer is formed over one of a first surface of the substrate. Conductive material is introduced into the via to form a feedthrough.

Claims

1. An implantable medical device (IMD) comprising:

A sensor substrate that includes a first surface and a second surface, and a via that extends through the first and the second surfaces;

a dielectric layer that is formed over at least one of a first surface of the substrate; and

a conductive material is introduced into the via to form a feedthrough.

2. The IMD of claim 1 wherein the conductive material being one of tantalum (Ta), niobium (Nb), titanium (Ti), platinum (Pt), gold (Au), and alloys thereof.

3. The IMD of claim 1 wherein the via includes a first inner diameter at the first surface and a second inner diameter at the second surface.

4. The IMD of claim 3, wherein the second inner diameter is smaller than the first inner diameter.

5. The IMD of claim 4, wherein the smaller second inner diameter reduces an aspect ratio of the via.

6. A method for forming a feedthrough for an implantable medical device comprising:

providing a substrate with a first surface and a second surface, the substrate includes a via that extends through the first and the second surfaces;

introducing a dielectric layer to one of a first surface of the substrate; and

introducing conductive material to the via to form a feedthrough.

7. The method of claim 6 wherein the substrate is a sensor substrate.

8. The method of claim 6 further comprising:

coupling temporarily a base to a first surface of the sensor substrate with the dielectric layer disposed between the first surface of the sensor substrate and the base.

9. The method of claim 8 further comprising:

removing the base and dielectric layer from the first surface of the substrate.

10. The method of claim 6 wherein the conductive material being one of Ta, Nb, Ti, Pt, Au, and alloys thereof.

11. A system for forming a feedthrough in a sensor for use in an implantable medical device comprising:

a control module;

a holding device adapted to securely position a substrate, the substrate includes a first surface and a second surface with a via that extends through the first and second surfaces;

a dry reactive ion etcher for forming a dielectric layer in the sensor substrate; and

a conductive metal dispenser for introducing conductive metal into the via, the conductive metal dispenser coupled to the control module, the conductive metal dispenser configured to introduce conductive metal in the via.

12. The system of claim 11 wherein the conductive metal forms the feedthrough.

13. The system of claim 11 wherein the conductive material being one of Ta, Nb, Ti, Pt, Au, and alloys thereof.

14. The system of claim 11 wherein the via includes a first inner diameter at the first surface and a second inner diameter at the second surface of the substrate.

16. The method of claim 14, wherein the conductive material being one of Ta, Nb, Ti, Pt, Au, and alloys thereof.

15. A method for forming a feedthrough for a sensor associated with an implantable medical device, the method comprising:

providing a sensor substrate which includes a first surface and a second surface;

creating a first via in the sensor substrate;

creating a second via the sensor substrate, the second via in communication with the first via;

introducing a conductive material in the first and second vias; and

forming a feedthrough in the first and second vias.

17. A machine-readable medium that provides instructions, which when executed by a processor cause the processor to perform operations comprising:

providing a sensor substrate which includes a first surface and a second surface;

creating a first via in the sensor substrate;

creating a second via the sensor substrate, the second via in communication with the first via;

introducing a conductive material in the first and second vias; and

forming a feedthrough in the first and second vias.

18. The machine-readable medium of claim 17 wherein the conductive material being one of Ta, Nb, Ti, Pt, Au, and alloys thereof.

19. The machine-readable medium of claim 19 wherein the first via includes a first inner diameter at the first surface and a second via includes a second inner diameter at the second surface.

20. The machine-readable medium of claim 19 wherein the smaller second inner diameter reduces an aspect ratio of the via.