Electronic component connection support structures including air as a dielectric

• US 20080142250A1
• Filed: 12/18/2006
• Published: 06/19/2008
• Est. Priority Date: 12/18/2006
• Status: Active Grant

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: LSI Corporation (Broadcom, Inc.)
• Inventors: Tang, George C.
• Granted Patent: US 7,557,303 B2
• Time in Patent Office: Days
• US Class Current: 174/255
• CPC Class Codes: H05K 1/024 Dielectric details, e.g. changing the dielectric material around a transmission line
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections

Abstract

Electronic component supporting mediums includes dielectric support material having voids adapted to include the use of air as a dielectric, which is commonly used in printed circuit boards and electrical connectors. The support medium provides physical support to conductive connections and a mechanical structure to enable electrical connections between electronic components. Support structures including air as a dielectric can be provided in the form of printed circuit boards and electrical connectors. The printed circuit board of claim 16 wherein said dielectric material comprises a low loss material. The support medium can comprise a low loss material such as air, FR-4, Teflon material, and plastic.

Claims

1. An electronic component connection assembly comprising:

a dielectric material support structure having voids formed therein to include air as a dielectric; and

metal connections formed along or in between said dielectric material support structure(s), said dielectric material support structure serving to support electrical connections between said metal connections and at least one electronic component.

2. The electronic component connection assembly of claim 1 wherein said dielectric material comprises a higher loss material (e.g., FR4, Teflon) and a low loss material (e.g., air).

3. The electronic component connection assembly of claim 1 wherein said dielectric material comprises Teflon material.

4. The electronic component connection assembly of claim 1 wherein said support structure includes a grid adapted to operate as a printed circuit boards and/or electrical connectors.

5. The electronic component connection assembly of claim 1 wherein said dielectric material comprises air (low loss gas).

6. The electronic component connection assembly of claim 1 wherein said dielectric material comprises plastic grid or slice.

7. The electronic component connection assembly of claim 1 wherein said support structure provided in the form of at least two dielectric washer held within a hollow dielectric housing, said washers allowing wire to penetrate for making connection between two electronic components.

8. The electronic component connection assembly of claim 1 wherein said dielectric material comprises a low loss material.

9. The electronic component connection assembly of claim 1 wherein said dielectric material comprises FR-4 material.

10. The electronic component connection assembly of claim 1 wherein said dielectric material comprises plastic.

11. A printed circuit board comprising:

a dielectric material grid formed between first and second dielectric material layers, said grid adapted to contain air in space in voids formed between said grid and said first and second layers; and

conductive metal traces formed along or in between the dielectric material(s) at least one of said first and second layers, said conductive metal traces including connections to make electrical contact with electronic component(s).