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RAPID CONDUCTIVE COOLING USING A SECONDARY PROCESS PLANE

  • US 20080142497A1
  • Filed: 12/14/2006
  • Published: 06/19/2008
  • Est. Priority Date: 12/14/2006
  • Status: Active Grant
First Claim
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1. A substrate processing apparatus, comprising:

  • a chamber;

    a magnetically driven substrate support disposed in the chamber and comprising an annular body configured to support the substrate on an upper surface thereof;

    an annular extension coupled to the annular body; and

    a window coupled to the annular body, wherein the window is disposed below the substrate and is transparent to light and heat.

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