RAPID CONDUCTIVE COOLING USING A SECONDARY PROCESS PLANE

• US 20080142497A1
• Filed: 12/14/2006
• Published: 06/19/2008
• Est. Priority Date: 12/14/2006
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Sorabji, Khurshed, Lerner, Alexander N.
• Granted Patent: US 7,378,618 B1
• Time in Patent Office: Days
• US Class Current: 219/393
• CPC Class Codes: C30B 31/14 Substrate holders or susceptors
• CPC Class Codes: H01L 21/30 Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 manufacture of electrodes thereon H01L21/28
• CPC Class Codes: H01L 21/67098 Apparatus for thermal treatment
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/67115 mainly by radiation
• CPC Class Codes: H01L 22/10 Measuring as part of the manufacturing process burn-in G01R31/2855
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method and apparatus for thermally processing a substrate is described. The apparatus includes a substrate support configured to move linearly and/or rotationally by a magnetic drive. The substrate support is also configured to receive a radiant heat source to provide heating region in a portion of the chamber. An active cooling region comprising a cooling plate is disposed opposite the heating region. The substrate may move between the two regions to facilitate rapidly controlled heating and cooling of the substrate.

Claims

1. A substrate processing apparatus, comprising:

a chamber;

a magnetically driven substrate support disposed in the chamber and comprising an annular body configured to support the substrate on an upper surface thereof;

an annular extension coupled to the annular body; and

a window coupled to the annular body, wherein the window is disposed below the substrate and is transparent to light and heat.

2. The apparatus of claim 1, further comprising:

a heat source disposed in the chamber.

3. The apparatus of claim 2, wherein the heat source is disposed below the window.

4. The apparatus of claim 1, further comprising:

an annular ring detachably coupled to the annular extension.

5. The apparatus of claim 1, wherein the annular body is configured to magnetically couple to a stator assembly.

6. The apparatus of claim 1, further comprising:

a plurality of lift pins extending from an upper surface of the window.

7. A substrate processing apparatus, comprising:

a chamber having an interior volume which includes an upper portion and a lower portion;

a cooling source and a heat source disposed in the interior volume, the cooling source opposing the heat source; and

a levitating substrate support configured to move the substrate between the upper portion and the lower portion.

8. The apparatus of claim 7, wherein the cooling source is disposed in an upper portion of the interior volume and the heat source is disposed in a lower portion of the interior volume.

9. The apparatus of claim 7, wherein the cooling source comprises a black material.

10. The apparatus of claim 7, wherein the cooling source comprises at least one fluid channel for flowing a coolant therein.

11. The apparatus of claim 7, wherein the substrate support has an inside diameter sized to receive the heat source.

12. The apparatus of claim 7, wherein the substrate support has a support ring configured to receive and support the substrate.

13. The apparatus of claim 7, further comprising:

a window disposed between the heat source and the substrate, wherein the window is transparent to ultra-violet light.

14-28. -28. (canceled)

29. A substrate processing apparatus, comprising:

a chamber having an interior volume which includes an upper portion and a lower portion;

a cooling source in communication with the upper portion and a heat source disposed in the lower portion of the interior volume;

a levitating substrate support configured to move the substrate between the upper portion and the lower portion; and

a window disposed between the heat source and the substrate, wherein the window is transparent to ultra-violet light.

30. The apparatus of claim 29, wherein the cooling source comprises a cooling plate.

31. The apparatus of claim 30, wherein the cooling plate comprises a black material.

32. The apparatus of claim 30, wherein the cooling plate has an emissivity between about 0.70 to about 0.95.

33. The apparatus of claim 29, wherein the cooling source is a gas port coupled to a coolant source.

34. The apparatus of claim 29, wherein the cooling source comprises at least one fluid channel for flowing a coolant therein.

35. The apparatus of claim 29, wherein the cooling source comprises a cooling plate having at least one channel for flowing a coolant therein, and a gas port coupled to a coolant source.

36. The apparatus of claim 29, wherein the window includes a plurality of lift pins extending from an upper surface thereof.

37. A substrate processing apparatus, comprising:

a chamber having an interior volume which includes an upper portion and a lower portion;

a heat source disposed in the lower portion;

a cooling source disposed in the upper portion;

a magnetically driven substrate support at least partially disposed in the interior volume, the substrate support comprising an annular body configured to support the substrate on an upper surface thereof; and

a window disposed between the heat source and the substrate, wherein the window is transparent to ultra-violet light.

38. The apparatus of claim 37, wherein the window includes a plurality of lift pins extending from an upper surface thereof.

39. The apparatus of claim 37, wherein the cooling source comprises a cooling plate.

40. The apparatus of claim 39, wherein the cooling plate comprises a black material.

41. The apparatus of claim 39, wherein the cooling plate has an emissivity between about 0.70 to about 0.95.

42. The apparatus of claim 37, wherein the cooling source is a gas port coupled to a coolant source.

43. The apparatus of claim 37, wherein the cooling source comprises at least one fluid channel for flowing a coolant therein.