ELECTRONIC DEVICE

• US 20080142571A1
• Filed: 12/04/2007
• Published: 06/19/2008
• Est. Priority Date: 12/04/2006
• Status: Abandoned Application

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Yoshinari, Hideto, Ikeda, Ukyo, Yokozuka, Takehide, Harada, Masahide
• Application Number:
  US11/949,849
• Publication Number:
  US 20080142571A1
• Time in Patent Office: Days
• US Class Current: 228/110.1
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/0979 Redundant conductors or connections, i.e. more than one current path between two points
• CPC Class Codes: H05K 2201/1028 Thin metal strips as connectors or conductors
• CPC Class Codes: H05K 2201/10303 Pin-in-hole mounted pins
• CPC Class Codes: H05K 2201/10318 Surface mounted metallic pins
• CPC Class Codes: H05K 2201/10856 Divided leads, e.g. by slot in length direction of lead, or by branching of the lead
• CPC Class Codes: H05K 2201/10924 Leads formed from a punched metal foil
• CPC Class Codes: H05K 2203/0285 Using ultrasound, e.g. for cleaning, soldering or wet treatment
• CPC Class Codes: H05K 3/328 by welding
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: H05K 3/368 parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 3/4015 using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres

Abstract

Since an electronic device of the present invention has a pair of joint pieces thereof formed (extended) on both sides with respect to one end of the body thereof, the pair of joint pieces both connected to one of the substrates improves the joining strength between the lead frame connector and the one of substrates and ensures the reliability of electrical connection between the lead frame connector and the one of the substrates.

Claims

1. An electronic device, comprising:

a first substrate having a first component mounted thereon;

a second substrate having a second component mounted thereon; and

a lead frame connector which connects the first and second substrates, the connector having a body, a first joint at one end of the body, and a second joint at the other end of the body, the first joint being formed such that two joint pieces mutually protrude in opposite directions substantially perpendicularly to the one end of the body at a boundary position between the body and the first joint;

wherein the first joint of the lead frame connector is joined with an electrode pad provided on the first substrate, and the second joint of the lead frame connector is joined with an electrode pad provided on the second substrate, thereby connecting the first and second substrates.

2. The electronic device according to claim 1, wherein:

the first component is a high heat generation component and the second component is a low heat generation component.

3. The electronic device according to claim 1, wherein:

the first and second substrates are arranged so that the component-mounted sides thereof face each other.

4. The electronic device according to claim 1, wherein:

the first substrate is a metal base substrate and the second substrate a resin substrate.

5. The electronic device according to claim 1, wherein:

the first joint is split into a plurality of joint pieces.

6. The electronic device according to claim 1, wherein:

each joint piece of the lead frame connector and the electrode pad are ultrasonically joined with an aluminum foil sandwiched therebetween.

7. The electronic device according to claim 6, wherein:

both the lead frame connector and the electrode pad are made of copper.

8. An electronic device, comprising:

a first substrate having a first component mounted thereon;

a second substrate having a second component mounted thereon; and

a lead frame connector which connects the first and second substrates, one end of the lead frame connector being formed in the T shape;

wherein the T-shaped one end is joined with an electrode pad provided on the first substrate, and the other end is joined with an electrode pad provided on the second substrate, thereby connecting the first and second substrates by means of the lead frame connector.

9. The electronic device according to claim 8, wherein:

the first component is a high heat generation component and the second component is a low heat generation component.

10. The electronic device according to claim 8, wherein:

the first and second substrates are arranged so that the component-mounted sides thereof face each other.

11. The electronic device according to claim 8, wherein:

the first substrate is a metal base substrate and the second substrate a resin substrate.

12. The electronic device according to claim 8, wherein:

each joint piece of the T-shaped one end of the lead frame connector and the electrode pad are ultrasonically joined with an aluminum foil sandwiched therebetween.

13. The electronic device according to claim 12, wherein:

both the lead frame connector and the electrode pad are made of copper.