LIGHT EMITTING DIODES (LEDS) WITH IMPROVED LIGHT EXTRACTION BY ROUGHENING
First Claim
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1. A method comprising:
- providing a light-emitting diode (LED) wafer assembly, comprising;
a conductive substrate;
a p-doped layer disposed above the conductive substrate;
an active layer disposed above the p-doped layer;
an n-doped layer disposed above the active layer;
applying a mask to a surface of the n-doped layer;
etching the surface of the n-doped layer such that protuberances remain on the etched surface, wherein lateral surfaces of the protuberances form an angle of greater than 90°
with the etched surface of the n-doped layer; and
roughening or texturing the etched surface of the n-doped layer including the protuberances.
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Abstract
Systems and methods are disclosed for fabricating a semiconductor light-emitting diode (LED) device by forming an n-doped gallium nitride (n-GaN) layer on the LED device and roughening the surface of the n-GaN layer to extract light from an interior of the LED device.
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Citations
20 Claims
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1. A method comprising:
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providing a light-emitting diode (LED) wafer assembly, comprising; a conductive substrate; a p-doped layer disposed above the conductive substrate; an active layer disposed above the p-doped layer; an n-doped layer disposed above the active layer; applying a mask to a surface of the n-doped layer; etching the surface of the n-doped layer such that protuberances remain on the etched surface, wherein lateral surfaces of the protuberances form an angle of greater than 90°
with the etched surface of the n-doped layer; androughening or texturing the etched surface of the n-doped layer including the protuberances. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method comprising:
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applying a mask to a surface of a light-emitting diode (LED) wafer; etching the surface of the LED wafer such that protuberances remain on the etched surface, wherein lateral surfaces of the protuberances form an angle of greater than 90°
with the etched surface of the LED wafer; androughening or texturing the etched surface of the LED wafer including the protuberances. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A light-emitting diode (LED) structure, comprising:
a multilayer semiconductor structure for emitting light, a surface of the structure having a plurality of protuberances, wherein lateral surfaces of the protuberances form an angle greater than 90°
with the surface of the multilayer semiconductor structure and wherein the surface of the structure and the protuberances are roughened or textured for increased surface area.- View Dependent Claims (18, 19, 20)
Specification