DISPLAY DEVICE, METHOD OF MANUFACTURING DISPLAY DEVICE, AND ELECTRONIC APPARATUS

• US 20080143949A1
• Filed: 03/12/2007
• Published: 06/19/2008
• Est. Priority Date: 03/14/2006
• Status: Active Grant

• Current Assignee: Japan Display West Incorporated (Japan Display Incorporated)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Ino, Masumitsu
• Granted Patent: US 8,274,633 B2
• Time in Patent Office: Days
• US Class Current: 349/151
• CPC Class Codes: G02F 1/133308 Support structures for LCD panels, e.g. frames or bezels
• CPC Class Codes: G02F 1/133528 Polarisers
• CPC Class Codes: G02F 1/13363 Birefringent elements, e.g. for optical compensation
• CPC Class Codes: G02F 1/1339 Gaskets; Spacers; Sealing of cells
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: G02F 1/13454 Drivers integrated on the active matrix substrate G02F1/136277 takes precedence
• CPC Class Codes: G02F 1/1368 in which the switching element is a three-electrode device G02F1/136277 takes precedence
• CPC Class Codes: G02F 2201/50 Protective arrangements
• CPC Class Codes: H01J 9/20 Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel

Abstract

Disclosed herein is a display device including: a first substrate with a pixel switch and drivers mounted thereon; a second substrate disposed in facing relation to the first substrate; a material layer held between the first substrate and the second substrate and having peripheral edges sealed by a seal member, the material layer having an electrooptical effect; and a semiconductor chip mounted as a COG component on the first substrate, the semiconductor chip having a control system configured to control the drivers; wherein the semiconductor chip having a thickness equal to the total thickness of the seal member and the second substrate or larger than the thickness of the seal member and smaller than the total thickness.

Claims

1. A display device comprising:

a first substrate with a pixel switch and drivers mounted thereon;

a second substrate disposed in facing relation to said first substrate;

a material layer held between said first substrate and said second substrate and having peripheral edges sealed by a seal member, said material layer having an electrooptical effect; and

a semiconductor chip mounted as a COG (Chip On Glass) component on said first substrate, said semiconductor chip having a control system configured to control said drivers;

wherein said semiconductor chip having a thickness equal to the total thickness of said seal member and said second substrate or larger than the thickness of said seal member and smaller than said total thickness.

2. The display device according to claim 1, further comprising

a protective fixing member disposed on at least a portion of said first substrate laterally of said semiconductor chip.

3. A display device comprising:

a first substrate with a pixel switch and drivers mounted thereon;

a second substrate disposed in facing relation to said first substrate;

a material layer held between said first substrate and said second substrate and having peripheral edges sealed by a seal member, said material layer having an electrooptical effect;

a semiconductor chip mounted as a COG component on said first substrate, said semiconductor chip having a control system configured to control said drivers; and

a protective fixing member disposed on at least a portion of said first substrate laterally of said semiconductor chip;

wherein said semiconductor chip having a thickness equal to or smaller than the distance from a surface of said first substrate which faces said material layer to a surface of said second substrate which faces away from said material layer.

4. A display device comprising:

a first substrate with a pixel switch and drivers mounted thereon;

a second substrate disposed in facing relation to said first substrate;

a material layer held between said first substrate and said second substrate and having peripheral edges sealed by a seal member, said material layer having an electrooptical effect;

a polarizing plate and phase difference plate combination disposed on said second substrate remotely from said material layer; and

a semiconductor chip mounted as a COG component on said first substrate, said semiconductor chip having a control system configured to control said drivers;

wherein said semiconductor chip having a thickness smaller than the total thickness of said seal member, said second substrate, and said polarizing plate and phase difference plate combination.

5. The display device according to claim 4, wherein said polarizing plate and phase difference plate combination is disposed on said second substrate, said semiconductor chip having a thickness equal to or smaller than at least the total thickness of said seal member and said second substrate.

6. The display device according to claim 4, further comprising

a protective fixing member disposed on at least a portion of said first substrate laterally of said semiconductor chip.

7. The display device according to claim 5, further comprising

a protective fixing member disposed on at least a portion of said first substrate laterally of said semiconductor chip.

8. A display device comprising:

a first substrate with a pixel switch and drivers mounted thereon;

a second substrate disposed in facing relation to said first substrate;

a material layer having an electrooptical effect;

a first polarizing plate and phase difference plate combination disposed between said first substrate and said material layer;

a second polarizing plate and phase difference plate combination disposed between said second substrate and said material layer;

a seal member holding said material layer between said first and second polarizing plate and phase difference plate combinations thereby to seal said material layer; and

a semiconductor chip mounted as a COG component on said first substrate, said semiconductor chip having a control system configured to control said drivers;

wherein said semiconductor chip having a thickness equal to or smaller than the total thickness of said first and second polarizing plate and phase difference plate combinations, said material layer, and said second substrate.

9. The display device according to claim 8, wherein said seal member is disposed between said first and second polarizing plate and phase difference plate combinations.

10. The display device according to claim 8,

wherein said first and second polarizing plate and phase difference plate combinations are disposed inwardly of a region in which said material layer is sealed by said seal member, and

said seal member being disposed between said first substrate and said second substrate alongside of said first and second polarizing plate and phase difference plate combinations.

11. The display device according to claim 8, further comprising

a protective fixing member disposed on at least a portion of said first substrate laterally of said semiconductor chip.

12. The display device according to claim 9, further comprising

a protective fixing member disposed on at least a portion of said first substrate laterally of said semiconductor chip.

13. The display device according to claim 10, further comprising

a protective fixing member disposed on at least a portion of said first substrate laterally of said semiconductor chip.

14. A method of manufacturing a display device having a first substrate with a pixel switch and drivers mounted thereon, a second substrate disposed in facing relation to said first substrate, and a material layer held between said first substrate and said second substrate and sealed by a seal member, comprising:

a first step of mounting a semiconductor chip having a control system configured to control said drivers, as a COG component on said first substrate parallel to a region in which said seal member and said second substrate are stacked;

a second step of filling a space around said semiconductor chip with a protective fixing member thereby to secure said first substrate and said semiconductor chip to each other; and

a third step of simultaneously polishing said second substrate and said semiconductor chip to the same thickness as each other.

15. The electronic apparatus having a display device, said display device comprising:

a first substrate with a pixel switch and drivers mounted thereon;

a second substrate disposed in facing relation to said first substrate;

a material layer held between said first substrate and said second substrate and having peripheral edges sealed by a seal member, said material layer having an electrooptical effect; and

a semiconductor chip mounted as a COG component on said first substrate, said semiconductor chip having a control system configured to control said drivers;

wherein said semiconductor chip having a thickness equal to the total thickness of said seal member and said second substrate or larger than the thickness of said seal member and smaller than said total thickness.

16. The electronic apparatus having a display device, said display device comprising:

a first substrate with a pixel switch and drivers mounted thereon;

a second substrate disposed in facing relation to said first substrate;

a material layer held between said first substrate and said second substrate and having peripheral edges sealed by a seal member, said material layer having an electrooptical effect;

a polarizing plate and phase difference plate combination disposed on said second substrate remotely from said material layer; and

a semiconductor chip mounted as a COG component on said first substrate, said semiconductor chip having a control system configured to control said drivers;

wherein said semiconductor chip having a thickness smaller than the total thickness of said seal member, said second substrate, and said polarizing plate and phase difference plate combination.

17. The electronic apparatus having a display device, said display device comprising:

a first substrate with a pixel switch and drivers mounted thereon;

a second substrate disposed in facing relation to said first substrate;

a material layer having an electrooptical effect;

a first polarizing plate and phase difference plate combination disposed between said first substrate and said material layer;

a second polarizing plate and phase difference plate combination disposed between said second substrate and said material layer;

a seal member holding said material layer between said first and second polarizing plate and phase difference plate combinations thereby to seal said material layer; and

a semiconductor chip mounted as a COG component on said first substrate, said semiconductor chip having a control system configured to control said drivers;

wherein said semiconductor chip having a thickness equal to or smaller than the total thickness of said first and second polarizing plate and phase difference plate combinations, said material layer, and said second substrate.