Electronic device and method for manufacturing the same

• US 20080145007A1
• Filed: 12/13/2006
• Published: 06/19/2008
• Est. Priority Date: 12/13/2006
• Status: Abandoned Application

• Current Assignee: Moog Incorporated
• Original Assignee: Moog Incorporated
• Inventors: Crumpton, Eric
• Application Number:
  US11/637,780
• Publication Number:
  US 20080145007A1
• Time in Patent Office: Days
• US Class Current: 385/94
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/4255 Moulded or casted packages
• CPC Class Codes: G02B 6/428 containing printed circuit boards [PCB]
• CPC Class Codes: G02B 6/4285 Optical modules characterised by a connectorised pigtail
• CPC Class Codes: G02B 6/4427 Pressure resistant cables, e.g. undersea cables

Abstract

An electronic device comprises a hollow housing defining an enclosed cavity therewithin, an electronic unit disposed within the cavity, and a potting compound filling the cavity in the housing and encapsulating at least one electronic component of the electronic unit. The potting material has a compressive strength allowing the electronic device to withstand pressure of up to 10,000 psi. A method for manufacturing the electronic device comprises the steps of: providing the housing with the enclosed cavity therewithin, inserting the electronic unit into the cavity, providing the potting material, and introducing the potting material into the cavity so that a space around the electronic unit is filled with the potting material to encapsulate the electronic unit.

Claims

1. A method for manufacturing a fiber-optic transceiver, said method comprising the steps of:

a) providing a housing defining an enclosed cavity therewithin;

b) inserting an electronic unit into said cavity;

c) providing a potting material; and

d) introducing said potting material into said cavity so that an entire space in said cavity around said electronic unit being completely filled with said potting material to encapsulate said electronic unit; and

curing said potting material in said housing in order to harden said potting material subsequent to the step of introducing said potting material into said cavity;

said potting material being a thermally conductive epoxy potting compound having a compressive strength from about 5,000 psi to about 10,000 psi after the step of curing said potting material.

2. The method for manufacturing said fiber-optic transceiver as defined in claim 1, wherein said step of providing said potting material includes the step of degassing said potting material so as to make said potting material substantially free of air bubbles.

3. The method for manufacturing said fiber-optic transceiver as defined in claim 2, wherein the step of degassing said potting material includes the step of vacuuming said potting material in a vacuum chamber by a vacuum pump.

4. The method for manufacturing said fiber-optic transceiver as defined in claim 3, wherein said compressive strength of said potting material after the step of degassing said potting material is from about 5,000 psi to about 10,000 psi.

5. The method for manufacturing said fiber-optic transceiver as defined in claim 1, wherein the step of providing said housing includes the step of forming at least one access opening in said housing.

6. The method for manufacturing said fiber-optic transceiver as defined in claim 5, wherein step of introducing said potting material into said cavity is conducted through said at least one access opening.

7. The method for manufacturing said fiber-optic transceiver as defined in claim 6, further including the step of covering said housing with molding material with the exception of said at least one access opening so as to block gaps in said housing executed prior to the step of introducing said potting material into said cavity.

8. The method for manufacturing said fiber-optic transceiver as defined in claim 2, further including the step of additional degassing of said potting material within said housing subsequent to the step of introducing said potting material into said cavity.

9. The method for manufacturing said fiber-optic transceiver as defined in claim 8, wherein the step of additional degassing of said potting material includes the step of vacuuming said potting material in a vacuum chamber by a vacuum pump.

11. The method for manufacturing said fiber-optic transceiver as defined in claim 1, wherein said step of curing said potting material includes the step of heating said electronic device in order to cure and harden said potting material in said housing.

12. The method for manufacturing said fiber-optic transceiver as defined in claim 1, further including the step of testing said electronic device under fluid pressure of about 10,000 psi subsequent to the step of curing said electronic device.

10. (canceled)

13. (canceled)

14. A fiber-optic transceiver An electronic device comprising:

a hollow housing defining an enclosed cavity therewithin;

an electronic unit disposed within said cavity, said electronic unit having at least one electronic component; and

a potting compound completely filling an entire space in said cavity in said housing around said electronic unit so as to encapsulate said electronic unit;

said potting material being a thermally conductive epoxy potting compound having a compressive strength from about 5,000 ps to about 10,000 psi when fully cured.

16. The fiber-optic transceiver as defined in claim 14, wherein said potting material is substantially free of air bubbles.

17. The fiber-optic transceiver as defined in claim 16, wherein said potting material is degassed prior to filling said cavity in said housing.

18. The fiber-optic transceiver as defined in claim 17, wherein said degassing of said potting material was conducted in a vacuum chamber by a vacuum pump.

15. (canceled)

19. (canceled)