Electronic device and method for manufacturing the same
First Claim
1. A method for manufacturing a fiber-optic transceiver, said method comprising the steps of:
- a) providing a housing defining an enclosed cavity therewithin;
b) inserting an electronic unit into said cavity;
c) providing a potting material; and
d) introducing said potting material into said cavity so that an entire space in said cavity around said electronic unit being completely filled with said potting material to encapsulate said electronic unit; and
curing said potting material in said housing in order to harden said potting material subsequent to the step of introducing said potting material into said cavity;
said potting material being a thermally conductive epoxy potting compound having a compressive strength from about 5,000 psi to about 10,000 psi after the step of curing said potting material.
5 Assignments
0 Petitions
Accused Products
Abstract
An electronic device comprises a hollow housing defining an enclosed cavity therewithin, an electronic unit disposed within the cavity, and a potting compound filling the cavity in the housing and encapsulating at least one electronic component of the electronic unit. The potting material has a compressive strength allowing the electronic device to withstand pressure of up to 10,000 psi. A method for manufacturing the electronic device comprises the steps of: providing the housing with the enclosed cavity therewithin, inserting the electronic unit into the cavity, providing the potting material, and introducing the potting material into the cavity so that a space around the electronic unit is filled with the potting material to encapsulate the electronic unit.
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Citations
19 Claims
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1. A method for manufacturing a fiber-optic transceiver, said method comprising the steps of:
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a) providing a housing defining an enclosed cavity therewithin; b) inserting an electronic unit into said cavity; c) providing a potting material; and d) introducing said potting material into said cavity so that an entire space in said cavity around said electronic unit being completely filled with said potting material to encapsulate said electronic unit; and curing said potting material in said housing in order to harden said potting material subsequent to the step of introducing said potting material into said cavity; said potting material being a thermally conductive epoxy potting compound having a compressive strength from about 5,000 psi to about 10,000 psi after the step of curing said potting material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 11, 12)
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10. (canceled)
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13. (canceled)
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14. A fiber-optic transceiver An electronic device comprising:
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a hollow housing defining an enclosed cavity therewithin; an electronic unit disposed within said cavity, said electronic unit having at least one electronic component; and a potting compound completely filling an entire space in said cavity in said housing around said electronic unit so as to encapsulate said electronic unit; said potting material being a thermally conductive epoxy potting compound having a compressive strength from about 5,000 ps to about 10,000 psi when fully cured. - View Dependent Claims (16, 17, 18)
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15. (canceled)
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19. (canceled)
Specification