Super thin LED package for the backlighting applications and fabrication method
First Claim
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1. A method comprising:
- disposing first and second light emitting diode (LED) arrays, which each includes a corresponding number of LED dies, on a substrate proximately and substantially parallel to one another;
covering each pair of substantially paralleled LED dies of the first and second arrays by substantially transparent optical encapsulant;
one of covering the optical encapsulant by a reflective layer for a UV to visible spectral region and shaping the optical encapsulant for total internal reflection; and
dicing the substrate along an axis extending in parallel and between the first and second LED arrays to form a light emitting surface.
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Abstract
First and second light emitting diode (LED) arrays, which each includes a corresponding number of LED dies, are disposed on a substrate proximately and substantially parallel to one another. Each pair of substantially paralleled LED dies of the first and second arrays is covered by substantially transparent optical encapsulant. The optical encapsulant is one of covered by a reflective layer for a UV to visible spectral region and shaped for total internal light reflection. The substrate is diced along an axis extending in parallel and between the first and second LED arrays.
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Citations
20 Claims
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1. A method comprising:
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disposing first and second light emitting diode (LED) arrays, which each includes a corresponding number of LED dies, on a substrate proximately and substantially parallel to one another; covering each pair of substantially paralleled LED dies of the first and second arrays by substantially transparent optical encapsulant; one of covering the optical encapsulant by a reflective layer for a UV to visible spectral region and shaping the optical encapsulant for total internal reflection; and dicing the substrate along an axis extending in parallel and between the first and second LED arrays to form a light emitting surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method of fabricating a thin light emitting diode (LED) backlight comprising:
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fabricating a substrate including; disposing a first metal layer on a first surface of a layer of flexible material, and disposing a second metal layer on a second surface of the layer of flexible material; disposing a first LED array, which includes at least two LED dies, proximately to the first metal layer; disposing a second LED array, which includes a number of LED dies equal to a number of the first array LED dies, proximately to the first metal layer in close proximity and substantially parallel to the first array; covering each pair of substantially paralleled LED dies of the first and second arrays by substantially transparent optical encapsulant; disposing a reflective layer about the optical encapsulant; and dicing the substrate along an axis extending in parallel and between the first and second LED arrays. - View Dependent Claims (19)
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20. A light emitting diode (LED) package comprising:
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a substrate which includes; a layer of a flexible material, a first metal layer disposed on a first surface of the flexible layer, and a second metal layer disposed on a second surface of the flexible layer; and an LED die disposed about the first metal layer and covered by substantially transparent optical encapsulant which is covered by a reflective layer for a UV to visible spectral region, a thickness of the LED package is less than or equal to about 600 um.
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Specification