STACK STRUCTURE AND METHOD OF MANUFACTURING THE SAME
First Claim
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1. A method of manufacturing a stack structure provided with a plurality of substrates including at least a first substrate, a second substrate including glass and a third substrate, comprising:
- applying a first electric field acting in a direction between the first and second substrates to bond a first bonding film located between one of surfaces of the first substrate and one of surfaces of the second substrate to oxygen atoms in the glass in the second substrate, and also to effect anodic bonding of the first and second substrates to each other in such a manner as to incorporate alkali components in the glass in the second substrate into a buffer film provided on the other surface of the second substrate, andapplying a second electric field acting in the same direction as the first electric field, between the second substrate and the third substrate including glass to bond a second bonding film which is located between the other surface of the second substrate and one of the surfaces of the third substrate, to oxygen atoms in the glass of the second substrate, and also to effect anodic bonding of the second and third substrates in such a manner as to incorporate alkali components in the glass of the third substrate into a second buffer film provided on the other surface of the third substrate.
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Abstract
A stack structure is formed by stacking and bonding a plurality of substrates. The stack structure includes bonding films each of which is interposed in a bonding region between, adjacent glass substrates, and bonded to oxygen atoms in the glass of the substrate by anodic bonding.
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Citations
11 Claims
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1. A method of manufacturing a stack structure provided with a plurality of substrates including at least a first substrate, a second substrate including glass and a third substrate, comprising:
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applying a first electric field acting in a direction between the first and second substrates to bond a first bonding film located between one of surfaces of the first substrate and one of surfaces of the second substrate to oxygen atoms in the glass in the second substrate, and also to effect anodic bonding of the first and second substrates to each other in such a manner as to incorporate alkali components in the glass in the second substrate into a buffer film provided on the other surface of the second substrate, and applying a second electric field acting in the same direction as the first electric field, between the second substrate and the third substrate including glass to bond a second bonding film which is located between the other surface of the second substrate and one of the surfaces of the third substrate, to oxygen atoms in the glass of the second substrate, and also to effect anodic bonding of the second and third substrates in such a manner as to incorporate alkali components in the glass of the third substrate into a second buffer film provided on the other surface of the third substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of manufacturing a stack structure provided with a plurality of structures, comprising:
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bonding a first substrate, which is included in the plurality of substrates and which comprises one of silicon and glass, to oxygen atoms in glass in a second substrate included in the plurality of substrates, and also to effect anodic bonding between the first and second substrates in such a manner as to incorporate alkali components in the glass in the second substrate into a buffer film provided on a surface of the second substrate to which the first substrate is not bonded; and bonding a bonding film provided between the second substrate and a third substrate, which is included in the plurality of substrates and which comprises glass, to oxygen atoms in the glass in the second substrate, by applying an electric field acting as in the anodic bonding between the first and second substrates, and effecting anodic bonding between the second and third substrates in such a manner as to incorporate alkali components in the glass in the third substrate into a buffer film provided on a surface of the third substrate to which the second substrate is bonded.
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Specification