STRUCTURED THERMAL TRANSFER ARTICLE

• US 20080148570A1
• Filed: 03/07/2008
• Published: 06/26/2008
• Est. Priority Date: 11/07/2005
• Status: Abandoned Application

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Tuma, Phillip E., Palmgren, Gary M.
• Application Number:
  US12/044,412
• Publication Number:
  US 20080148570A1
• Time in Patent Office: Days
• US Class Current: 29/890.054
• CPC Class Codes: H01L 23/3732 Diamonds
• CPC Class Codes: H01L 23/3733 having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures H01L23/3732, H01L23/3737 take precedence
• CPC Class Codes: H01L 23/3736 Metallic materials H01L23/3732, H01L23/3733, H01L23/3735, H01L23/3737, H01L23/3738 take precedence
• CPC Class Codes: H01L 23/44 the complete device being wholly immersed in a fluid other than air H01L23/427 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49393 with metallurgical bonding

Abstract

Structured thermal transfer article comprising a plurality of metal bodies and a plurality of interstitial elements disposed between and connecting the plurality of metal bodies to one another. The metal bodies comprise an inner portion comprising a first metal and an outer portion comprising an alloy comprising the first metal and a second metal. The interstitial elements comprise the alloy of the outer portion.

Claims

1. A method of forming a structured thermal transfer article comprising:

providing a production tool having a predetermined array of mold cavities, depositing a composition comprising a binder and a plurality of metal bodies onto said production tool, said metal bodies comprising an inner portion comprising a first metal having a melting temperature T_mp1, and an outer portion comprising a second metal having a melting temperature T_mp2; and

heating said composition to a temperature less than T_mp1 and T_mp2 to form an alloy comprising said first metal and said second metal that bonds said plurality of metal bodies to one another, wherein said bond forms a porous matrix.

2. The method of claim 1 wherein said first metal is selected from the group consisting of aluminum, copper, silver, and alloys thereof.

3. The method of claim 1 wherein said second metal is the group consisting of copper, silver, magnesium, and alloys thereof.

4. The method of claim 1 wherein said first metal comprises copper and said second metal comprises silver.

5. The method of claim 1 wherein said binder is selected from the group consisting of mineral oil, silicone oil, kerosene, and polyvinyl butyral.

6. The method claim 1 wherein said metal bodies further comprise diamond.

7. The method of claim 1 further comprising introducing a backing that said alloy comprising said first metal and said second metal form a bond with.

8. The method of claim 7, wherein said metal bodies are deposited on a surface of said backing before heating the composition.

9. The method of claim 8, wherein depositing said metal bodies on said surface of said backing comprises formation of said metal bodies by physical vapor deposition, plasma deposition, electroless plating, electrolytic plating, immersion plating, and combinations thereof.

10. The method of claim 1, wherein said metal bodies are randomly shaped bodies, selected from polyhedrons, flakes, chips, fibers, plates, cylinders, needles, and combinations thereof.