Coplanar mounting member for a MEM sensor

• US 20080148850A1
• Filed: 06/28/2007
• Published: 06/26/2008
• Est. Priority Date: 05/09/2002
• Status: Abandoned Application

• Current Assignee: David S. Hanson, Joseph W. Soucy, Richard S. Anderson, Thomas F. Marinis
• Original Assignee: David S. Hanson, Joseph W. Soucy, Richard S. Anderson, Thomas F. Marinis
• Inventors: Anderson, Richard S., Marinis, Thomas F., Hanson, David S., Soucy, Joseph W.
• Application Number:
  US11/823,747
• Publication Number:
  US 20080148850A1
• Time in Patent Office: Days
• US Class Current: 73/514.16
• CPC Class Codes: G01C 21/166 Mechanical, construction or arrangement details of inertial navigation systems
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: H05K 2201/09027 Non-rectangular flat PCB, e.g. circular
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2201/10378 Interposers
• CPC Class Codes: H05K 2201/10454 Vertically mounted
• CPC Class Codes: H05K 2201/10484 Obliquely mounted
• CPC Class Codes: H05K 3/301 by means of a mounting structure H05K3/325 takes precedence

Abstract

A three axes MEM accelerometer system includes three MEM accelerometer sensors and a MEM sensor board including a MEM sensor control circuit for the accelerometer sensors. The accelerometer sensors are mounted mutually orthogonally. At least two coplanar mounting members have a first surface coplanar with a connection pad on the surface of the sensor board. A second surface is inclined to the surface of the board for mounting a MEM accelerometer sensor. An electrical conductor array interconnects the MEM accelerometer sensor with the connection pad on the board.

Claims

1. A three axes MEM accelerometer system comprising:

three MEM accelerometer sensors;

a MEM sensor board including a MEM sensor control circuit for said accelerometer sensors;

said accelerometer sensors being mounted mutually orthogonally;

at least two coplanar mounting members having a first surface coplanar with a connection pad on the surface of said sensor board, a second surface inclined to said surface of said board for mounting a MEM accelerometer sensor, and an electrical conductor array for interconnecting the MEM accelerometer sensor with the connection pad on the board.

2. The MEMs accelerometer system of claim 1 in which there are two coplanar mounting members and said second surface is at approximately 90°

.

3. The MEMs accelerometer system of claim 1 in which there are three coplanar mounting members and each said second surface is at approximately 54°

.

4. A three axes MEMs gyroscope system comprising:

three MEM gyroscopes;

a MEM sensor board including a MEM sensor electronic current for said gyroscope sensors;

said gyroscope sensors being mounted mutually orthogonally;

at least one coplanar mounting member having a first surface coplanar with a connection pad on the surface of said sensor board, a second surface inclined to said surface of said board for mounting a MEM gyroscope sensor, and an electrical conductor array for interconnecting a MEM gyroscope sensor with the connection pad on the board.

5. The MEMs gyroscope system of claim 4 in which there is one coplanar mounting member and said second surface is at approximately 90°

.

6. The MEMs gyroscope system of claim 4 in which there are three coplanar mounting members and each said second surface is at approximately 35°

.