MULTILAYER WIRING BOARD AND POWER SUPPLY STRUCTURE TO BE EMBEDDED IN MULTILAYER WIRING BOARD

• US 20080149384A1
• Filed: 11/26/2007
• Published: 06/26/2008
• Est. Priority Date: 12/21/2006
• Status: Active Grant

• Current Assignee: NGK Spark PLUG Company Limited (Niterra Co., Ltd.)
• Original Assignee: NGK Spark PLUG Company Limited (Niterra Co., Ltd.)
• Inventors: Kawabe, Tadahiko
• Granted Patent: US 8,093,506 B2
• Time in Patent Office: Days
• US Class Current: 174/265
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/0219 Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 2201/096 Vertically aligned vias, holes or stacked vias
• CPC Class Codes: H05K 2201/09809 Coaxial layout
• CPC Class Codes: H05K 3/4046 using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
• CPC Class Codes: H05K 3/4602 characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A multilayer wiring board capable of feeding sufficient electric power to a circuit element, such as an IC chip. In one embodiment of the present invention, a multilayer wiring board is comprised of: a core board; a build up layer disposed on an upper surface of the core board; a build up layer disposed on a lower surface of the core board; and a power supply structure embedded in a through hole penetrating the core board and the build up layers. The power supply structure is comprised of: a conductive metal rod made of copper as a main material; a conductive metal tube made of copper as a main material and provided coaxially with the conductive metal rod; and an insulating material filling a gap between the conductive metal rod and the conductive metal tube.

Claims

1. A multilayer wiring board comprising:

a core board having a main surface and a rear surface;

a first laminated wiring portion having a structure in which a plurality of main surface side insulating layers and a plurality of main surface side conductor layers are alternately laminated on the main surface, and an element mounting portion is provided on a surface of the first laminated wiring portion;

a second laminated wiring portion having a structure in which a plurality of rear surface side insulating layers and a plurality of rear surface side conductor layers are alternately laminated on the rear surface;

a through hole conductor formed in the core board and electrically connecting the main surface side conductor layer and the rear surface side conductor layer; and

a power supply structure comprised of a conductive metal member which is made of copper as a main material and embedded in a through hole which penetrates the first laminated wiring portion, the core board and the second laminated wiring portion,

wherein the conductive metal member is electrically connected to the main surface side conductor layer for the power supply and the rear surface side conductor layer for the power supply, respectively.

2. A multilayer wiring board according to claim 1,

wherein the power supply structure is comprised of a conductive metal rod made of copper as a main material.

3. A multilayer wiring board according to claim 1,

wherein the power supply structure is comprised of:

a conductive metal rod made of copper as a main material;

a conductive metal tube provided coaxially with the conductive metal rod and made of copper as a main material; and

an insulating material which fills a gap between the conductive metal rod and the conductive metal tube.

4. A multilayer wiring board according to claim 3,

wherein a main surface side end portion of the conductive metal rod is electrically connected to the main surface side conductor layer for the power supply and a rear surface side end portion of the conductive metal rod is electrically connected to the rear surface side conductor layer for the power supply, and

wherein a main surface side end portion of the conductive metal tube is electrically connected to a main surface side conductor layer for a ground and a rear surface side end portion of the conductive metal tube is electrically connected to a rear surface side conductor layer for the ground.

5. A multilayer wiring board according to claim 3,

wherein the conductive metal tube has a notch formed at least in one of the main surface side end portion and the rear surface side end portion thereof, and

wherein at least one of the main surface side conductor layer and the rear surface side conductor layer for the power supply is laid in a location where the notch is formed.

6. A multilayer wiring board according to claim 3,

wherein the conductive metal tube has a flange-like or a tab-like pad portion at least in one of the main surface side end portion and the rear surface side end portion thereof, and

wherein the pad portion is electrically connected to at least one of the main surface side conductor layer and the rear surface side conductor layer for the ground.

7. A multilayer wiring board according to claim 1,

wherein the element mounting portion is provided on a generally center of the core board, and the power supply structure is provided at plural locations in the outer circumference portion of the core board.

8. A multilayer wiring board according to claim 1, wherein resistance of the power supply structure is 3 μ

ohm/cm² or less.

9. A multilayer wiring board according to claim 1,

wherein the power supply structure has a smaller diameter than that of the through hole conductor.

10. A multi layer wiring board according to claim 9,

wherein the power supply structure is formed so as to penetrate the through hole conductor formed in the core board.

11. A multilayer wiring board according to claim 10,

wherein the power supply structure is fixed using a conductive adhesive.

12. A multilayer wiring board according to claim 9,

wherein the power supply structure is formed in a location where no through hole conductor formed in the core board is provided.

13. A multilayer wiring board according to claim 12,

wherein the power supply structure is fixed using a conductive adhesive.

14. A multilayer wiring board according to claim 9,

wherein the main surface side conductor layer includes a wiring pattern for the ground and a wiring pattern for the power supply,

wherein the wiring pattern for the ground is provided so as to sandwich the wiring pattern for the power supply and extended to an area where the element mounting portion is formed.

15. A power supply structure to be embedded in a multilayer wiring board comprising:

a conductive metal rod made of copper as a main material;

a conductive metal tube provided coaxially with the conductive metal rod and made of copper as a main material; and

an insulating material which fills a gap between the conductive metal rod and the conductive metal tube.

16. A power supply structure to be embedded in a multilayer wiring board according to claim 15,

wherein the conductive metal tube has a notch formed at least in one of the main surface side end portion and the rear surface side end portion thereof.

17. A power supply structure to be embedded in a multilayer wiring board according to claim 15,

wherein the conductive metal tube has a flange-like or a tab-like pad portion at least in one of the main surface side end portion and the rear surface side end portion thereof.

18. A power supply structure to be embedded in a multilayer wiring board according to claim 15,

wherein the resistance of the power supply structure is 3 μ

ohm/cm² or less.

19. A method for manufacturing a multilayer wiring board, comprising:

(a) a core board having a main surface and a rear surface;

(b) a first laminated wiring portion having a structure in which a plurality of main surface side insulating layers and a plurality of main surface side conductor layers are alternately laminated on the main surface, and an element mounting portion is provided on a surface of the first laminated wiring portion;

(c) a second laminated wiring portion having a structure in which a plurality of rear surface side insulating layers and a plurality of rear surface side conductor layers are alternately laminated on the rear surface;

(d) a through hole conductor formed in the core board and electrically connecting the main surface side conductor layer and the rear surface side conductor layer; and

(e) a power supply structure composed of a conductive metal member which is made of copper as a main material and embedded in a through hole which penetrates the first laminated wiring portion, the core board and the second laminated wiring portion, wherein the conductive metal member is electrically connected to the main surface side conductor layer and the rear surface side conductor layer for the power supply, respectively, said method comprising the steps of;

providing a through hole after forming the first laminated wiring portion and the second laminated wiring portion;

embedding the power supply structure in the through hole;

forming a conductor layer connected to a conductive metal member of the power supply structure; and

providing a solder resist.