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MULTILAYER WIRING BOARD AND POWER SUPPLY STRUCTURE TO BE EMBEDDED IN MULTILAYER WIRING BOARD

  • US 20080149384A1
  • Filed: 11/26/2007
  • Published: 06/26/2008
  • Est. Priority Date: 12/21/2006
  • Status: Active Grant
First Claim
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1. A multilayer wiring board comprising:

  • a core board having a main surface and a rear surface;

    a first laminated wiring portion having a structure in which a plurality of main surface side insulating layers and a plurality of main surface side conductor layers are alternately laminated on the main surface, and an element mounting portion is provided on a surface of the first laminated wiring portion;

    a second laminated wiring portion having a structure in which a plurality of rear surface side insulating layers and a plurality of rear surface side conductor layers are alternately laminated on the rear surface;

    a through hole conductor formed in the core board and electrically connecting the main surface side conductor layer and the rear surface side conductor layer; and

    a power supply structure comprised of a conductive metal member which is made of copper as a main material and embedded in a through hole which penetrates the first laminated wiring portion, the core board and the second laminated wiring portion,wherein the conductive metal member is electrically connected to the main surface side conductor layer for the power supply and the rear surface side conductor layer for the power supply, respectively.

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