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SYSTEM-IN-PACKAGE HAVING REDUCED INFLUENCE BETWEEN CONDUCTOR AND ANTENNA AND METHOD OF DESIGNING THE SAME

  • US 20080149736A1
  • Filed: 12/06/2007
  • Published: 06/26/2008
  • Est. Priority Date: 12/21/2006
  • Status: Active Grant
First Claim
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1. A System-in-Package (SiP) having a reduced influence between a conductor and an antenna, comprising:

  • an antenna configured to function to transmit or receive data and mounted in the SiP to be integrated in the SiP; and

    a first planar conductor having at least one slit formed therein.

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