SYSTEM-IN-PACKAGE HAVING REDUCED INFLUENCE BETWEEN CONDUCTOR AND ANTENNA AND METHOD OF DESIGNING THE SAME
First Claim
1. A System-in-Package (SiP) having a reduced influence between a conductor and an antenna, comprising:
- an antenna configured to function to transmit or receive data and mounted in the SiP to be integrated in the SiP; and
a first planar conductor having at least one slit formed therein.
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Accused Products
Abstract
The present invention relates to a SiP having reduced influence between a conductor and an antenna, and a method of designing the SiP. The SiP includes an antenna configured to function to transmit or receive data and mounted in the SiP to be integrated in the SiP, and a first planar conductor having at least one slit formed therein. Therefore, the present invention minimizes the amount of current or electromagnetic field induced on the conductor by the current or electromagnetic field of the antenna, thus reducing the influence of the conductor on the operating characteristics of the antenna.
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Citations
16 Claims
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1. A System-in-Package (SiP) having a reduced influence between a conductor and an antenna, comprising:
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an antenna configured to function to transmit or receive data and mounted in the SiP to be integrated in the SiP; and a first planar conductor having at least one slit formed therein. - View Dependent Claims (2, 3, 4)
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5. A planar conductor for a System-in-Package (SiP), comprising:
at least one slit formed therein to reduce current or an electromagnetic field induced on the conductor by current or an electromagnetic field of an antenna integrated in the SiP.
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6. A method of designing a System-in-Package (SiP) having a reduced influence between a conductor and an antenna, comprising:
forming at least one slit in a first planar conductor included in the SiP to reduce current or an electromagnetic field induced on the conductor by current or an electromagnetic field of the antenna integrated in the SiP. - View Dependent Claims (7, 8)
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9. A System-in-Package (SiP) having a reduced influence between a conductor and an antenna, comprising:
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an antenna configured to function to transmit or receive data and mounted in the SiP to be integrated in the SiP; and a layer for supplying power or providing ground through a linear conductor.
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10. A method of designing a System-in-Package (SiP) having a reduced influence between a conductor and an antenna, comprising:
allowing power to be supplied or ground to be provided into the SiP through a linear conductor.
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11. A System-in-Package (SiP) having reduced influence between a conductor and an antenna, comprising:
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an antenna configured to function to transmit or receive data and mounted in the SiP to be integrated in the SiP; and a planar conductor having a cutout formed therein at a feeding point of the antenna. - View Dependent Claims (12, 13)
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14. A method of designing a System-in-Package (SiP) having a reduced influence between a conductor and an antenna, comprising:
forming a cutout in a planar conductor, included in the SiP, at a feeding point of an antenna integrated in the SiP. - View Dependent Claims (15, 16)
Specification