SYSTEM-IN-PACKAGE HAVING REDUCED INFLUENCE BETWEEN CONDUCTOR AND ANTENNA AND METHOD OF DESIGNING THE SAME

• US 20080149736A1
• Filed: 12/06/2007
• Published: 06/26/2008
• Est. Priority Date: 12/21/2006
• Status: Active Grant

• Current Assignee: Korea Advanced Institute of Science and Technology
• Original Assignee: Korea Advanced Institute of Science and Technology
• Inventors: KIM, Gawon, KIM, Joungho, RYU, Chung Hyun
• Granted Patent: US 7,757,959 B2
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48229 the bond pad protruding from the surface of the item
• CPC Class Codes: H01L 2224/48237 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 9/27 Spiral antennas
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

The present invention relates to a SiP having reduced influence between a conductor and an antenna, and a method of designing the SiP. The SiP includes an antenna configured to function to transmit or receive data and mounted in the SiP to be integrated in the SiP, and a first planar conductor having at least one slit formed therein. Therefore, the present invention minimizes the amount of current or electromagnetic field induced on the conductor by the current or electromagnetic field of the antenna, thus reducing the influence of the conductor on the operating characteristics of the antenna.

Claims

1. A System-in-Package (SiP) having a reduced influence between a conductor and an antenna, comprising:

an antenna configured to function to transmit or receive data and mounted in the SiP to be integrated in the SiP; and

a first planar conductor having at least one slit formed therein.

2. The SiP according to claim 1, wherein the slit is formed to reduce current or an electromagnetic field induced on the first conductor by current or an electromagnetic field of the antenna.

3. The SiP according to claim 2, wherein the slit is formed to be perpendicular to a direction of a current path of the antenna.

4. The SiP according to claim 1, further comprising a second planar conductor having at least one slit formed therein to be symmetrical or asymmetrical to the slit formed in the first conductor.

5. A planar conductor for a System-in-Package (SiP), comprising:

at least one slit formed therein to reduce current or an electromagnetic field induced on the conductor by current or an electromagnetic field of an antenna integrated in the SiP.

6. A method of designing a System-in-Package (SiP) having a reduced influence between a conductor and an antenna, comprising:

forming at least one slit in a first planar conductor included in the SiP to reduce current or an electromagnetic field induced on the conductor by current or an electromagnetic field of the antenna integrated in the SiP.

7. The method according to claim 6, wherein the slit is formed to be perpendicular to a direction of a current path of the antenna.

8. The method according to claim 7, further comprising:

forming at least one slit in a second planar conductor included in the SiP so that the slit of the second conductor is formed to be symmetrical or asymmetrical with respect to the slit of the first conductor.

9. A System-in-Package (SiP) having a reduced influence between a conductor and an antenna, comprising:

an antenna configured to function to transmit or receive data and mounted in the SiP to be integrated in the SiP; and

a layer for supplying power or providing ground through a linear conductor.

10. A method of designing a System-in-Package (SiP) having a reduced influence between a conductor and an antenna, comprising:

allowing power to be supplied or ground to be provided into the SiP through a linear conductor.

11. A System-in-Package (SiP) having reduced influence between a conductor and an antenna, comprising:

an antenna configured to function to transmit or receive data and mounted in the SiP to be integrated in the SiP; and

a planar conductor having a cutout formed therein at a feeding point of the antenna.

12. The SiP according to claim 11, wherein the cutout is formed to reduce current or an electromagnetic field induced on the conductor by current or an electromagnetic field of the antenna.

13. The SiP according to claim 12, wherein the conductor has at least one slit formed therein to reduce current or an electromagnetic field induced on the conductor by current or an electromagnetic field of the antenna.

14. A method of designing a System-in-Package (SiP) having a reduced influence between a conductor and an antenna, comprising:

forming a cutout in a planar conductor, included in the SiP, at a feeding point of an antenna integrated in the SiP.

15. The method according to claim 14, wherein the cutout is formed to reduce current or an electromagnetic field induced on the conductor by current or an electromagnetic field of the antenna.

16. The method according to claim 15, further comprising forming at least one slit in the conductor to reduce current or an electromagnetic field induced on the conductor by current or an electromagnetic field of the antenna.