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Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device

  • US 20080149924A1
  • Filed: 02/28/2008
  • Published: 06/26/2008
  • Est. Priority Date: 08/18/2005
  • Status: Active Grant
First Claim
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1. A method for hermetically sealing a device, said method comprising the steps of:

  • positioning an un-encapsulated device in a desired location with respect to a deposition device; and

    using the deposition device to deposit a sealing material over at least a portion of the un-encapsulated device to form a hermetically sealed device without having to perform a post-deposition heat treating step.

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