Transistor having recess channel and fabricating method thereof
First Claim
Patent Images
1. A transistor, comprising:
- a substrate including a trench;
an insulation layer filled in a portion of the trench, the insulation layer having a greater thickness over an edge portion of a bottom surface of the trench than over a middle portion of the bottom surface of the trench;
a gate insulation layer formed over inner sidewalls of the trench, the gate insulation layer having a thickness smaller than the insulation layer; and
a gate electrode filled in the trench.
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Accused Products
Abstract
A transistor includes a substrate including a trench, an insulation layer filled in a portion of the trench, the insulation layer having a greater thickness over an edge portion of a bottom surface of the trench than over a middle portion of the bottom surface of the trench, a gate insulation layer formed over inner sidewalls of the trench, the gate insulation layer having a thickness smaller than the insulation layer, and a gate electrode filled in the trench.
25 Citations
22 Claims
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1. A transistor, comprising:
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a substrate including a trench; an insulation layer filled in a portion of the trench, the insulation layer having a greater thickness over an edge portion of a bottom surface of the trench than over a middle portion of the bottom surface of the trench; a gate insulation layer formed over inner sidewalls of the trench, the gate insulation layer having a thickness smaller than the insulation layer; and a gate electrode filled in the trench. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A transistor, comprising:
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a substrate including a trench; an insulation layer filled in a portion of the trench, the insulation layer having a V shape; a gate insulation layer formed over inner sidewalls of the trench, the gate insulation layer having a thickness smaller than the insulation layer; and a gate electrode filled in the trench. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A method for fabricating a transistor, comprising:
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forming a trench in a substrate; forming a polysilicon layer over the substrate and filled in the trench; etching the polysilicon layer in a manner that a portion of the polysilicon layer having a greater thickness over an edge portion of a bottom surface of the trench than over a middle portion of the bottom surface of the trench remains in the trench; oxidizing the remaining portion of the polysilicon layer to form an insulation layer over the bottom surface of the trench and forming a gate insulation layer over inner sidewalls of the trench to a smaller thickness than the insulation layer at substantially the same time; and forming a gate electrode over the insulation layer and filled in the trench. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification