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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

  • US 20080150102A1
  • Filed: 10/16/2007
  • Published: 06/26/2008
  • Est. Priority Date: 10/16/2006
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • at least one semiconductor element, andplural conductor plates, wherein an electrical connection inside the semiconductor device is established by the plural conductor plates; and

    wherein the plural conductor plates are disposed three-dimensionally so that respective weld parts provided to the plural conductor plates are exposed toward a laser light source used in laser welding.

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