SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
First Claim
1. A semiconductor device comprising:
- at least one semiconductor element, andplural conductor plates, wherein an electrical connection inside the semiconductor device is established by the plural conductor plates; and
wherein the plural conductor plates are disposed three-dimensionally so that respective weld parts provided to the plural conductor plates are exposed toward a laser light source used in laser welding.
3 Assignments
0 Petitions
Accused Products
Abstract
An electrical connection inside a semiconductor device is established by lead frames formed of plural conductor plates. The lead frames are disposed three-dimensionally so that the respective weld parts thereof are exposed toward a laser light source used in the laser welding. The laser welding is then performed by irradiating a laser beam. According to the above, welding can be performed readily in a reliable manner. The productivity of the semiconductor device and the manufacturing method of the semiconductor device can be thus enhanced. In addition, because the lead frames have the cooling effect, they have the capability of a heat spreader. It is thus possible to provide a semiconductor device and a manufacturing method of the semiconductor device with high productivity.
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Citations
20 Claims
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1. A semiconductor device comprising:
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at least one semiconductor element, and plural conductor plates, wherein an electrical connection inside the semiconductor device is established by the plural conductor plates; and wherein the plural conductor plates are disposed three-dimensionally so that respective weld parts provided to the plural conductor plates are exposed toward a laser light source used in laser welding. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A manufacturing method of a semiconductor device incorporating at least one semiconductor element and establishing an electrical connection inside the semiconductor device by laser welding of plural conductor plates, comprising:
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disposing the plural conductor plates three-dimensionally so that respective weld parts provided to the plural conductor plates are exposed toward a laser light source used in the laser welding; and irradiating a laser beam to the respective weld parts. - View Dependent Claims (19, 20)
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Specification