INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING MOLD FLASH PREVENTION TECHNOLOGY

• US 20080150119A1
• Filed: 12/22/2006
• Published: 06/26/2008
• Est. Priority Date: 12/22/2006
• Status: Active Grant

• Current Assignee: Stats Chippac Pte. Ltd. (JCET Group Co., Ltd.)
• Original Assignee: Stats Chippac BVI limited (JCET Group Co., Ltd.)
• Inventors: Bae, JoHyun, Song, Sungmin, Jang, Ki Youn
• Granted Patent: US 8,252,615 B2
• Time in Patent Office: Days
• US Class Current: 257/690
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4824 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15331 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

An integrated circuit package system that includes: providing a support structure including an integrated circuit and an electrical contact adjacent thereto; providing a first mold having a first cavity with a projection and a recess for collecting flash; engaging the first mold on the support structure with the first cavity over at least a portion of the integrated circuit and the projection and the recess between the at least a portion of the integrated circuit and the electrical contact; and injecting encapsulation material into the first cavity.

Claims

1. An integrated circuit package system comprising:

providing a support structure including an integrated circuit and an electrical contact adjacent thereto;

providing a first mold having a first cavity with a projection and a recess for collecting flash;

engaging the first mold on the support structure with the first cavity over at least a portion of the integrated circuit and the projection and the recess between the at least a portion of the integrated circuit and the electrical contact; and

injecting encapsulation material into the first cavity.

2. The system as claimed in claim 1 further comprising:

stopping a mold flash between the first cavity and the projection or between the first cavity and the recess.

3. The system as claimed in claim 1 further comprising:

stopping a mold flash in the recess.

4. The system as claimed in claim 1 wherein:

providing the support structure includes forming a solder mask around the integrated circuit and the electrical contact.

5. The system as claimed in claim 4 wherein:

engaging the first mold on the support structure includes the first mold engaging the solder mask with the projection engaging or compressing the solder mask.

6. An integrated circuit package system comprising:

providing a support structure including an integrated circuit and an electrical contact;

providing a first mold having a first cavity with a projection and a recess for collecting flash;

engaging the first mold and the support structure with the first cavity over a feature and the projection and the recess between the feature and the electrical contact;

providing a second mold having a second cavity provided therein;

engaging the support structure, the first mold, and the second mold with the second cavity of the second mold over at least a portion of the integrated circuit; and

injecting encapsulation material into the second cavity.

7. The system as claimed in claim 6 wherein:

providing the first mold includes configuring the recess with a first opening and a second opening.

8. The system as claimed in claim 6 further comprising:

configuring the recess to include a poly-sided configuration or a curved configuration.

9. The system as claimed in claim 6 further comprising:

configuring the projection and the recess to retard the flow of mold flash.

10. The system as claimed in claim 6 further comprising:

configuring the integrated circuit package system to include a board-on-chip configuration.

11. An integrated circuit package system comprising:

a support structure with an integrated circuit; and

an encapsulant flash on the support structure that is defined by a first mold with a projection and a recess.

12. The system as claimed in claim 11 wherein:

the projection and the recess of the first mold prevent the encapsulant flash from obscuring an electrical contact.

13. The system as claimed in claim 11 wherein:

the projection and the recess of the first mold affect the formation of the encapsulant flash.

14. The system as claimed in claim 11 wherein:

the support structure includes a printed wiring board.

15. The system as claimed in claim 11 wherein:

the encapsulant flash is between the integrated circuit and an electrical contact.

16. The system as claimed in claim 11 wherein:

the encapsulant flash is between a feature and an electrical contact.

17. The system as claimed in claim 11 wherein:

the encapsulant flash is defined by a first opening and a second opening of the recess.

18. The system as claimed in claim 11 wherein:

the integrated circuit package system includes a Package-on-Package configuration.

19. The system as claimed in claim 11 wherein:

the integrated circuit package system includes a Board-on-Chip configuration.

20. The system as claimed in claim 11 wherein:

the encapsulant flash does not occupy an entire area of a recess coverage area.