THERMAL MANAGEMENT OF DIES ON A SECONDARY SIDE OF A PACKAGE
First Claim
1. An apparatus comprising:
- a first die mounted on a primary side of an electronic package;
a second die mounted on a secondary side of the electronic package, between the electronic package and a printed circuit board; and
a thermal component thermally coupled to the second die and the printed circuit board, the thermal component comprising a set of pins extending from a heat sink through a set of through-holes in the printed circuit board.
1 Assignment
0 Petitions
Accused Products
Abstract
An apparatus including a first die mounted on a primary side of an electronic package and a second die mounted on a secondary side of the electronic package between the electronic package and a printed circuit board. The apparatus further comprising a thermal component thermally connected to the second die and mounted on the printed circuit board, the thermal component comprising a set of pins extending from a heat sink through a set of through-holes in the printed circuit board. A method including positioning a set of thermal connectors through a printed circuit board, the thermal connectors extending from a primary side of the printed circuit board to a secondary side of the printed circuit board opposite the primary side. The method further including thermally connecting the thermal connectors to a die positioned between an electronic package and the primary side of the printed circuit board to transfer heat from the die to the secondary side of the printed circuit board.
46 Citations
25 Claims
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1. An apparatus comprising:
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a first die mounted on a primary side of an electronic package; a second die mounted on a secondary side of the electronic package, between the electronic package and a printed circuit board; and a thermal component thermally coupled to the second die and the printed circuit board, the thermal component comprising a set of pins extending from a heat sink through a set of through-holes in the printed circuit board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A system comprising:
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an electronic appliance comprising; a first die mounted on a primary side of an electronic package a second die mounted on a secondary side of the electronic package between the electronic package and a printed circuit board; the printed circuit board mounted in parallel to the second die, the printed circuit board comprising a primary side and a secondary side opposite the primary side; a thermal component thermally coupled to the second die, the thermal component comprising a heat sink and a set of pins, the heat sink mounted to the secondary side of the printed circuit board and the set of pins extending from the heat sink through a set of through-holes in the printed circuit board; and a thermal interface material coupled to the thermal component and the second die. - View Dependent Claims (11, 12, 13, 14)
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15. A method comprising:
positioning a set of thermal connectors through a printed circuit board, the set of thermal connectors extending from a primary side of the printed circuit board to a secondary side of the printed circuit board opposite the primary side; and
thermally coupling the set of thermal connectors to a die positioned between an electronic package and the primary side of the printed circuit board to transfer heat from the die to the secondary side of the printed circuit board.- View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
Specification