HIGH DENSITY PLANAR ELECTRICAL INTERFACE
1 Assignment
0 Petitions
Accused Products
Abstract
An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.
-
Citations
27 Claims
-
1-22. -22. (canceled)
-
23. A method comprising:
-
providing a plurality of cables in an array, the plurality of cables comprising respective conductors having ends disposed in a plane of a body of the array, the ends disposed at a pitch suitable for interfacing with one or more chip-scale components; and routing signals through the conductors of the plurality of cables between a first electronic component and a second electronic component. - View Dependent Claims (24, 25, 26, 27)
-
Specification