Voltage Regulator Integrated with Semiconductor Chip
First Claim
1. A semiconductor chip comprising:
- a silicon substrate;
multiple active devices in or over said silicon substrate, wherein said active devices comprise a switch controller and a voltage feedback device, wherein said switch controller and said voltage feedback device comprise multiple MOS devices;
a first dielectric layer over said silicon substrate;
a metallization structure over said first dielectric layer, wherein said metallization structure is connected to said active devices, and wherein said metallization structure comprises a first metal layer and a second metal layer over said first metal layer;
a second dielectric layer between said first and second metal layers;
a passivation layer over said metallization structure and over said first and second dielectric layers, an opening in said passivation layer exposing a pad and a contact pad of said metallization structure; and
an inductor component and a capacitor component connected to said pads through a first solder layer, wherein said inductor component, said capacitor component, a switch controller and voltage feedback device form a on-chip voltage regulator.
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Accused Products
Abstract
The present invention reveals a semiconductor chip structure and its application circuit network, wherein the switching voltage regulator or converter is integrated with a semiconductor chip by chip fabrication methods, so that the semiconductor chip has the ability to regulate voltage within a specific voltage range. Therefore, when many electrical devices of different working voltages are placed on a Printed Circuit Board (PCB), only a certain number of semiconductor chips need to be constructed. Originally, in order to account for the different demands in voltage, power supply units of different output voltages, or a variety of voltage regulators need to be added. However, using the built-in voltage regulator or converter, the voltage range can be immediately adjusted to that which is needed. This improvement allows for easier control of electrical devices of different working voltages and decreases response time of electrical devices.
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Citations
20 Claims
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1. A semiconductor chip comprising:
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a silicon substrate; multiple active devices in or over said silicon substrate, wherein said active devices comprise a switch controller and a voltage feedback device, wherein said switch controller and said voltage feedback device comprise multiple MOS devices; a first dielectric layer over said silicon substrate; a metallization structure over said first dielectric layer, wherein said metallization structure is connected to said active devices, and wherein said metallization structure comprises a first metal layer and a second metal layer over said first metal layer; a second dielectric layer between said first and second metal layers; a passivation layer over said metallization structure and over said first and second dielectric layers, an opening in said passivation layer exposing a pad and a contact pad of said metallization structure; and an inductor component and a capacitor component connected to said pads through a first solder layer, wherein said inductor component, said capacitor component, a switch controller and voltage feedback device form a on-chip voltage regulator. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A semiconductor chip comprising:
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a silicon substrate; multiple active devices in or over said silicon substrate, wherein said active devices comprise a switch controller and a voltage feedback device, wherein said switch controller and said voltage feedback device comprise multiple MOS devices; a first dielectric layer over said silicon substrate; a metallization structure over said first dielectric layer, wherein said metallization structure is connected to said active devices, and wherein said metallization structure comprises a first metal layer and a second metal layer over said first metal layer; a second dielectric layer between said first and second metal layers; a passivation layer over said metallization structure and over said first and second dielectric layers, an opening in said passivation layer exposing a pad and a contact pad of said metallization structure; and an inductor component and a capacitor component connected to said pads through a first solder layer, wherein said inductor component, said capacitor component, a switch controller and voltage feedback device form a on-chip voltage converter. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification