Multi-layered symmetric helical inductor

• US 20080150670A1
• Filed: 12/19/2007
• Published: 06/26/2008
• Est. Priority Date: 12/20/2006
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Chung, Chul-ho, Jeong, Joo-hyun
• Application Number:
  US12/000,931
• Publication Number:
  US 20080150670A1
• Time in Patent Office: Days
• US Class Current: 336/84C
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/002 Details of via holes for interconnecting the layers
• CPC Class Codes: H01F 27/36 Electric or magnetic shields or screens movable for varying inductance H01F21/10
• CPC Class Codes: H01F 27/363 made of electrically conductive material

Abstract

Provided is an inductor of a semiconductor device. The inductor may include a current entrance section, multiple layered ring-shaped conductive wires, and a via plug. Each of the ring-shaped conductive wires may be a helical type multi turn ring-shaped wire formed in one plane. The via plug may be connected to at least one of the ring-shaped conductive wires in order to transmit an electrical signal to another ring-shaped conductive wire.

Claims

1. An inductor of a semiconductor device comprising:

at least one current entrance section;

a plurality of multiple layered ring-shaped conductive wires, each of the ring-shaped conductive wires being a helical type multi-turn ring-shaped wire and formed in one plane; and

at least one via plug connected to at least one of the ring-shaped conductive wires for transmitting an electrical signal to another ring-shaped conductive wire.

2. The inductor of claim 1, wherein the ring-shaped conductive wires include at least one via pad to electrically connect to the at least one via plug.

3. The inductor of claim 2, wherein the at least one via pad is formed on one of end sections of the ring-shaped conductive wires.

4. The inductor of claim 3, wherein the at least one via pad is larger than the at least one via plug.

5. The inductor of claim 2, wherein each of the via pads is formed on both end sections of the ring-shaped conductive wires.

6. The inductor of claim 5, wherein one of the via pads is formed on the inside of the ring-shaped conductive wires and another via pad is formed on the outside of the ring-shaped conductive wires.

7. The inductor of claim 2, wherein the number of via pads of each of the uppermost ring-shaped conductive wire and the lowermost ring-shaped conductive wire is one.

8. The inductor of claim 7, wherein the at least one current entrance section is formed on the opposite end section of the section in which the via pad is formed on.

9. The inductor of claim 1, wherein current direction of the via plugs are identical.

10. The inductor of claim 1, wherein the ring-shaped conductive wires are formed in an octagonal shape.

11. The inductor of claim 1, wherein the ring-shaped conductive wires are formed in a symmetrical shape.

12. The inductor of claim 11, wherein the shapes of the ring-shaped conductive wires forming odd layers are identical and the shapes of the ring-shaped conductive wires forming even layers are identical.

13. The inductor of claim 11, wherein the ring-shaped conductive wires forming odd layers are in a mirroring shape with respect to the ring-shaped conductive wires forming even layers.

14. The inductor of claim 1, wherein the number of layers of ring-shaped conductive wires is even.

15. The inductor of claim 1, further comprising:

a ground shield pattern under the ring-shaped conductive wires.

16. The inductor of claim 15, wherein the ground shield pattern includes L-shaped unit shield patterns formed in a square ground line.

17. The inductor of claim 16, wherein the L-shaped unit shield patterns are formed in a symmetrical shape.

18. The inductor of claim 15, wherein the ground shield pattern includes a mesh shaped unit shield pattern formed in a ground line.

19. The inductor of claim 15, wherein the ground shield pattern includes a bar shaped unit shield pattern formed in a ground line.

20. The inductor of claim 15, wherein the ground shield pattern includes a protruding shaped unit shield pattern.