Exposure Apparatus and Device Manufacturing Method

• US 20080151200A1
• Filed: 02/17/2005
• Published: 06/26/2008
• Est. Priority Date: 02/19/2004
• Status: Abandoned Application

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Takaiwa, Hiroaki
• Application Number:
  US10/589,665
• Publication Number:
  US 20080151200A1
• Time in Patent Office: Days
• US Class Current: 355/30
• CPC Class Codes: G03F 7/70341 Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply chemical composition of immersion liquids G03F7/2041
• CPC Class Codes: G03F 7/70933 Purge, e.g. exchanging fluid or gas to remove pollutants

Abstract

An exposure apparatus (EX) has an exposure region (E) for irradiating exposure light (EL) to a substrate (W) through an optical system (30) and liquid (LQ) and has a measurement region (A) for acquiring information on the position of the substrate (W) prior to the exposure. The substrate (W) is exposed when moved between the exposure region (E) and the measurement region (A). The exposure apparatus (EX) has an entry shutoff mechanism (60) for preventing a gas (G) in the vicinity of the exposure region (E) from entering into the measurement region (A).

Claims

1-13. -13. (canceled)

14. An exposure apparatus comprising:

an exposure region in which, an optical member is disposed, and in which the substrate is exposed to exposure light via the optical member;

a measurement region in which a sensor is disposed, and in which the substrate is measured using the sensor in advance of exposure at the exposure region;

a movable member that holds the substrate and is movable between the exposure region and the measurement region; and

a prevent device which has a gas flow control member to prevent gas from moving between the exposure region and the measurement region.

15. The exposure apparatus according to claim 14, wherein

the prevent device sets the environment conditions of the exposure region or the measurement region or both regions.

16. The exposure apparatus according to claim 15, wherein

the environment conditions includes cleanliness or temperature or pressure or humidity or any combination of these.

17. The exposure apparatus according to claim 15, wherein the prevent device is an air conditioning device.

18. The exposure apparatus according to claim 14, wherein

the gas flow control member is a barrier disposed between the exposure region and the measurement region.

19. The exposure apparatus according to claim 18, wherein the barrier is an air curtain.

20. The exposure apparatus according to claim 14, wherein

the gas flow control member controls direction of a flow of gas so that movement of the gas between the exposure region and the measurement region is not risen.

21. The exposure apparatus according to claim 20, wherein

the gas flow control member comprises:

a chamber, which includes the exposure region and the measurement region, and

a blower that makes gas within the chamber flow from the measurement region toward the exposure region.

22. The exposure apparatus according to claim 21, wherein

the blower comprises:

an intake port formed on the measurement region, and

an exhaust port formed on the exposure region.

23. The exposure apparatus according to claim 22, wherein

the blower flows gas from the intake port toward the exhaust port along a surface that the movable member moves thereon.

24. The exposure apparatus according to claim 20, wherein

the gas flow control member includes an intake port and an exhaust port that are respectively formed in the exposure region and the measurement region.

25. The exposure apparatus according to claim 14, wherein

the prevent device includes a first gas intake portion disposed in the exposure region and a second gas intake portion disposed in the measurement region, wherein the gas supply of the first and second intake portions are individually controllable.

26. The exposure apparatus according to claim 14, wherein

the prevent device includes a first gas exhaust portion disposed in the exposure region and a second gas exhaust portion disposed in the measurement region, wherein the gas exhaust of the first and second exhaust portions are done individually.

27. The exposure apparatus according to claim 14, wherein

the prevent device includes a suction device that sucks gas of the exposure region.

28. The exposure apparatus according to claim 14, wherein

the prevent device prevents the gas from moving from the exposure region to the measurement region.

29. The exposure apparatus according to claim 28, wherein

the substrate is exposed to the exposure light via a liquid.

30. The exposure apparatus according to claim 29, further comprising:

an immersion device that forms an immersion area partially between the substrate and the optical member.

31. The exposure apparatus according to claim 29, wherein

the prevent device prevents the gas affected by the liquid from moving from the exposure region to the measurement region.

32. The exposure apparatus according to claim 14, further comprising:

a second movable member that is disposed in the same space of the movable member and is movable independently from the movable member.

33. The exposure apparatus according to claim 32, wherein

the second movable member can hold a substrate.

34. The exposure apparatus according to claim 32, wherein

the movable member and the second movable member move on a same base.

35. A device manufacturing method that includes a lithography process, wherein

an exposure apparatus of claim 14 is used in the lithography process.

36. An exposure apparatus comprising:

an exposure region in which an optical member is disposed, and in which the substrate is exposed to exposure light via the optical member;

a measurement region in which a sensor is disposed, and in which the substrate is measured using the sensor in advance of exposure at the exposure region;

a movable member that holds the substrate and is movable between the exposure region and the measurement region; and

a supply device which includes a first gas intake portion disposed in the exposure region and a second gas intake portion disposed in the measurement region, wherein the gas supply of the first and second intake portions are individually controllable.

37. The exposure apparatus according to claim 36, wherein

the properties of the gas supplied from the first gas intake portion and the gas supplied from the second gas intake portion are mutually different.

38. The exposure apparatus according to claim 36, wherein

an exhaust port is respectively formed in the exposure region and the measurement region.

39. The exposure apparatus according to claim 36, wherein

the intake device supplies a gas so that the environmental condition of the exposure region or the measurement region or both regions are set to the predetermined state.

40. The exposure apparatus according to claim 39, wherein

the environment conditions includes cleanliness or temperature or pressure or humidity or any combination of these.

41. The exposure apparatus according to claim 36, wherein

the supply device prevents the gas from moving from the exposure region to the measurement region.

42. The exposure apparatus according to claim 41, wherein

the substrate is exposed to the exposure light via a liquid.

43. The exposure apparatus according to claim 42, further comprising:

an immersion device that forms an immersion area partially between the substrate and the optical member.

44. The exposure apparatus according to claim 42, wherein

the supply device prevents the gas affected by the liquid from moving from the exposure region to the measurement region.

45. The exposure apparatus according to claim 36, further comprising:

a second movable member that is disposed in the same space of the movable member and is movable independently from the movable member.

46. The exposure apparatus according to claim 45, wherein

the second movable member can hold a substrate.

47. The exposure apparatus according to claim 45, wherein

the movable member and the second movable member move on a same base.

48. A device manufacturing method that includes a lithography process, wherein

an exposure apparatus of claim 36 is used in the lithography process.

49. An exposure apparatus comprising:

an exposure region in which an optical member is disposed, and in which the substrate is exposed to exposure light via the optical member;

a measurement region in which a sensor is disposed, and in which the substrate is measured using the sensor in advance of exposure at the exposure region;

a movable member that holds the substrate and is movable between the exposure region and the measurement region; and

an exhaust device which includes a first gas exhaust portion disposed in the exposure region and a second gas exhaust portion disposed in the measurement region, wherein the gas exhaust of the first and second exhaust portions are done individually.

50. The exposure apparatus according to claim 49, further comprising:

a supply device that supplies gas to the exposure region and to the measurement region.

51. The exposure apparatus according to claim 49, wherein

the exhaust device prevents the gas from moving from the exposure region to the measurement region.

52. The exposure apparatus according to claim 51, wherein

the substrate is exposed to the exposure light via a liquid.

53. The exposure apparatus according to claim 52, further comprising:

an immersion device that forms an immersion area partially between the substrate and the optical member.

54. The exposure apparatus according to claim 52, wherein

the exhaust device prevents the gas affected by the liquid from moving from the exposure region to the measurement region.

55. The exposure apparatus according to claim 49, further comprising:

a second movable member that is disposed in the same space of the movable member and is movable independently from the movable member.

56. The exposure apparatus according to claim 55, wherein

the second movable member can hold a substrate.

57. The exposure apparatus according to claim 55, wherein

the movable member and the second movable member move on a same base.

58. A device manufacturing method that includes a lithography process, wherein

an exposure apparatus of claim 49 is used in the lithography process.

59. An exposure method comprising:

measuring a substrate retained on a movable member at an measuring region;

moving, after the measurement, the substrate retained on the movable member from the measurement region to an exposure region; and

preventing gas from moving between the exposure region and the measurement region.

60. The method according to claim 59, wherein

preventing gas from moving by using a device that sets the environment conditions of the exposure region or the measurement region or both regions.

61. The method according to claim 60, wherein

the environment conditions includes cleanliness or temperature or pressure or humidity or any combination of these.

62. The method according to claim 60, wherein

the device includes an air conditioning device.

63. The method according to claim 59, wherein

preventing gas from moving includes providing a barrier between the exposure region and the measurement region.

64. The method according to claim 63, wherein

the barrier is an air curtain.

65. The method according to claim 59, wherein

preventing gas from moving includes controlling direction of a flow of gas so that movement of the gas between the exposure region and the measurement region is not risen.

66. The method according to claim 65, wherein

controlling direction of the flow of gas comprises:

providing a chamber, which includes the exposure region and the measurement region, and

flowing gas within the chamber from the measurement region toward the exposure region.

67. The method according to claim 66, wherein

controlling direction of the flow of gas includes providing an intake port at the measurement region and an exhaust port at the exposure region.

68. The method according to claim 67, wherein

flowing gas from the intake port to the exhaust port along a surface that the movable member moves thereon.

69. The method according to claim 65, wherein

preventing gas from moving includes providing an intake port and an exhaust port at the exposure region and the measurement region respectively.

70. The method according to claim 59, wherein

preventing gas from moving comprises:

providing a first gas intake portion at the exposure region;

providing a second gas intake portion at the measurement region; and

supplying gas from the first and second intake portions by controlling individually.

71. The method according to claim 59, wherein

preventing gas from moving includes exhausting from a first gas exhaust portion disposed in the exposure region and from a second gas exhaust portion disposed in the measurement region individually.

72. The method according to claim 59, wherein

preventing gas from moving includes sucking gas of the exposure region.

73. The method according to claim 59, wherein

preventing gas from moving is preventing gas from moving from the exposure region to the measurement region.

74. The method according to claim 73, further comprising:

exposing the substrate to exposure light via a liquid at the exposure region.

75. The method according to claim 74, further comprising:

forming an immersion area partially between the substrate and an optical member that irradiates the exposure light.

76. The method according to claim 74, wherein

preventing gas from moving includes preventing gas affected by the liquid from moving from the exposure region to the measurement region.

77. The method according to claim 59, further comprising:

providing a second movable member that is disposed in the same space of the movable member and is movable independently from the movable member.

78. The method according to claim 77, wherein

retaining a substrate by the second movable member.

79. The method according to claim 77, wherein

moving the movable member and the second movable member on a same base.

80. A device manufacturing method that includes a lithography process, wherein

an exposure method of claim 59 is used in the lithography process.

86. The method according to claim 79, further comprising:

preventing gas from moving from the exposure region to the measurement region.

87. The method according to claim 86, further comprising:

exposing the substrate to exposure light via a liquid at the exposure region.

88. The method according to claim 87, further comprising:

forming an immersion area partially between the substrate and an optical member that irradiates the exposure light.

89. The method according to claim 87, wherein

preventing gas from moving includes preventing gas affected by the liquid from moving from the exposure region to the measurement region.

81. An exposure method comprising:

measuring a substrate retained on a movable member at an measuring region;

moving, after the measurement, the substrate retained on the movable member from the measurement region to an exposure region;

supplying gas to the exposure region from a first gas intake portion disposed in the exposure region; and

supplying gas to the measurement region from a second gas intake portion disposed in the measurement portion, wherein

the gas supply of the first gas intake portion and the gas supply of the second gas intake portion are individually controllable.

82. The method according to claim 81, wherein

the properties of the gas supplied from the first gas intake portion and the gas supplied from the second gas intake portion are mutually different.

83. The method according to claim 81, further comprising:

providing an exhaust port at the exposure region and the measurement region respectively.

84. The method according to claim 81, wherein

supplying the gas so that the environmental condition of the exposure region or the measurement region or both regions are set to the predetermined state.

85. The method according to claim 84, wherein

the environment conditions includes cleanliness or temperature or pressure or humidity or any combination of these.

90. The method according to claim 81, further comprising:

providing a second movable member that is disposed in the same space of the movable member and is movable independently from the movable member.

91. The method according to claim 90, wherein

retaining a substrate by the second movable member.

92. The method according to claim 90, wherein

moving the movable member and the second movable member on a same base.

93. A device manufacturing method that includes a lithography process, wherein

an exposure method of claim 81 is used in the lithography process.

94. An exposure method comprising:

measuring a substrate retained on a movable member at an measuring region;

moving, after the measurement, the substrate retained on the movable member from the measurement region to an exposure region; and

exhausting from a first gas exhaust portion disposed in the exposure region and from a second gas exhaust portion disposed in the measurement region individually.

95. The method according to claim 94, further comprising:

supplying gas to the exposure region and to the measurement region by using a same supply device.

96. The method according to claim 94, further comprising:

preventing gas from moving from the exposure region to the measurement region.

97. The method according to claim 96, further comprising:

exposing the substrate to exposure light via a liquid at the exposure region.

98. The method according to claim 97, further comprising:

forming an immersion area partially between the substrate and an optical member that irradiates the exposure light.

99. The method according to claim 97, wherein

preventing gas from moving includes preventing gas affected by the liquid from moving from the exposure region to the measurement region.

100. The method according to claim 94, further comprising:

providing a second movable member that is disposed in the same space of the movable member and is movable independently from the movable member.

101. The method according to claim 100, wherein

retaining a substrate by the second movable member.

102. The method according to claim 100, wherein

moving the movable member and the second movable member on a same base.

103. A device manufacturing method that includes a lithography process, wherein

an exposure method of claim 94 is used in the lithography process.

104. An exposure apparatus comprising:

an exposure region for exposing a substrate to exposure light;

a measurement region for measuring the substrate in advance of exposure at the exposure region;

movable means for holding the substrate and for moving it between the exposure region and the measurement region; and

prevent means for preventing gas from moving between the exposure region and the measurement region.

105. A method for manufacturing an exposure apparatus comprising:

providing an exposure region in which, an optical member is disposed, and in which the substrate is exposed to exposure light via the optical member;

providing a measurement region in which a sensor is disposed, and in which the substrate is measured using the sensor in advance of exposure at the exposure region;

providing a movable member that holds the substrate and is movable between the exposure region and the measurement region; and

providing a prevent device which has a gas flow control member to prevent gas from moving between the exposure region and the measurement region.

106. An exposure apparatus comprising:

an exposure region for exposing a substrate to exposure light;

a measurement region for measuring the substrate in advance of exposure at the exposure region;

movable means for holding the substrate and for moving it between the exposure region and the measurement region; and

supply means including first gas intake means for supplying gas to the exposure region and second gas intake means for supplying gas to the measurement region, wherein the gas supply of the first and second intake means are individually controllable.

107. A method for manufacturing an exposure apparatus comprising:

providing an exposure region in which an optical member is disposed, and in which the substrate is exposed to exposure light via the optical member;

providing a measurement region in which a sensor is disposed, and in which the substrate is measured using the sensor in advance of exposure at the exposure region;

providing a movable member that holds the substrate and is movable between the exposure region and the measurement region; and

providing a supply device which includes a first gas intake portion disposed in the exposure region and a second gas intake portion disposed in the measurement region, wherein the gas supply of the first and second intake portions are individually controllable.

108. An exposure apparatus comprising:

an exposure region for exposing a substrate to exposure light;

a measurement region for measuring the substrate in advance of exposure at the exposure region;

movable means for holding the substrate and for moving it between the exposure region and the measurement region; and

exhaust means including first gas exhaust means for exhausting gas from the exposure region and second gas exhaust means for exhausting gas from the measurement region, wherein the gas exhaust of the first and second exhaust means are individually.

109. A method for manufacturing an exposure apparatus comprising:

providing an exposure region in which an optical member is disposed, and in which the substrate is exposed to exposure light via the optical member;

providing a measurement region in which a sensor is disposed, and in which the substrate is measured using the sensor in advance of exposure at the exposure region;

providing a movable member that holds the substrate and is movable between the exposure region and the measurement region; and

providing an exhaust device which includes a first gas exhaust portion disposed in the exposure region and a second gas exhaust portion disposed in the measurement region, wherein the first and second exhaust portions are individually exhaust gas in the exposure region and gas in the measurement region respectively.