ELECTROSTATIC CHUCK AND METHOD OF FORMING
First Claim
Patent Images
1. A Coulombic electrostatic chuck comprising:
- a substrate;
a conductive layer overlying the substrate;
an arc elimination layer overlying the conductive layer; and
a high-k dielectric layer overlying the arc elimination layer, wherein the high-k dielectric layer has a dielectric constant of not less than about 10 and a resistivity of not less than about 1011 Ohm-cm.
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Abstract
A Coulombic electrostatic chuck is disclosed which includes a substrate, a conductive layer overlying the substrate, and an arc elimination layer overlying the conductive layer. The electrostatic chuck further includes a high-k dielectric layer overlying the arc elimination layer, wherein the high-k dielectric layer has a dielectric constant of not less than about 10 and a resistivity of not less than about 1011 Ohm-cm.
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Citations
83 Claims
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1. A Coulombic electrostatic chuck comprising:
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a substrate; a conductive layer overlying the substrate; an arc elimination layer overlying the conductive layer; and a high-k dielectric layer overlying the arc elimination layer, wherein the high-k dielectric layer has a dielectric constant of not less than about 10 and a resistivity of not less than about 1011 Ohm-cm. - View Dependent Claims (4, 7, 15, 17, 20, 27, 28, 30, 31, 32, 35, 38, 40, 46, 48, 53)
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2-3. -3. (canceled)
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5-6. -6. (canceled)
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10-14. -14. (canceled)
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16. (canceled)
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18-19. -19. (canceled)
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21-26. -26. (canceled)
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29. (canceled)
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33-34. -34. (canceled)
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36-37. -37. (canceled)
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39. (canceled)
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41-45. -45. (canceled)
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47. (canceled)
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49-52. -52. (canceled)
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54-55. -55. (canceled)
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56. A method of forming an electrostatic chuck comprising:
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providing a substrate; forming a conductive layer comprising a conductive material overlying the substrate; forming an arc elimination layer overlying the conductive layer; and forming a high-k dielectric layer overlying the arc elimination layer, wherein the high-k dielectric layer has a dielectric constant of not less than about 10 and a resistivity of not less than about 1011 Ohm-cm. - View Dependent Claims (60, 61, 68, 75, 81)
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57-59. -59. (canceled)
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62-67. -67. (canceled)
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69-74. -74. (canceled)
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76-80. -80. (canceled)
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82. A method of forming an electronic device comprising:
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providing a Coulombic electrostatic chuck comprising (i) a substrate, (ii) a conductive layer overlying the substrate, (iii) an arc elimination layer overlying the conductive layer, and (iv) a high-k dielectric layer overlying the arc elimination layer, wherein the high-k dielectric layer has a dielectric constant of not less than about 10 and a resistivity of not less than about 1011 Ohm-cm, the high-k dielectric layer defining a work surface; providing a workpiece overlying the work surface; providing a voltage across the electrostatic chuck and the workpiece to maintain the workpiece in proximity to the work surface; and processing the workpiece to form an electronic device.
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83-90. -90. (canceled)
Specification