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Electroless deposition of cobalt alloys

  • US 20080152822A1
  • Filed: 12/22/2006
  • Published: 06/26/2008
  • Est. Priority Date: 12/22/2006
  • Status: Active Grant
First Claim
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1. A solution comprising:

  • a cobalt salt;

    a complexing agent configured to deposit a cobalt layer on copper using the cobalt salt; and

    a pH adjuster configured to adjust a pH of the solution to below 7.0.

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