Electroless deposition of cobalt alloys
First Claim
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1. A solution comprising:
- a cobalt salt;
a complexing agent configured to deposit a cobalt layer on copper using the cobalt salt; and
a pH adjuster configured to adjust a pH of the solution to below 7.0.
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Abstract
Systems and methods for electroless deposition of a cobalt-alloy layer on a copper surface include a solution characterized by a low pH. This solution may include, for example, a cobalt(II) salt, a complexing agent including at least two amine groups, a pH adjuster configured to adjust the pH to below 7.0, and a reducing agent. In some embodiments, the cobalt-alloy is configured to facilitate bonding and copper diffusion characteristics between the copper surface and a dielectric in an integrated circuit.
37 Citations
26 Claims
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1. A solution comprising:
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a cobalt salt; a complexing agent configured to deposit a cobalt layer on copper using the cobalt salt; and a pH adjuster configured to adjust a pH of the solution to below 7.0. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method comprising:
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preparing a solution configured to deposit a cobalt layer on copper, having a pH below 7.0 and comprising; a cobalt(II) salt, a complexing agent including at least two amine groups, and a pH adjuster configured to adjust the pH to below 7.0; immersing a copper surface into the solution; and depositing a cobalt-alloy layer on the copper surface using the solution. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26)
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Specification