RF Rx front end module for picocell and microcell base station transceivers

• US 20080153451A1
• Filed: 06/28/2007
• Published: 06/26/2008
• Est. Priority Date: 06/14/2006
• Status: Abandoned Application

• Current Assignee: CTS Corporation
• Original Assignee: CTS Corporation
• Inventors: Clark, Dean, Knecht, Thomas A., Reeser, Glen
• Application Number:
  US11/823,735
• Publication Number:
  US 20080153451A1
• Time in Patent Office: Days
• US Class Current: 455/349
• CPC Class Codes: H04B 1/04 Circuits
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/10371 Shields or metal cases
• CPC Class Codes: H05K 2201/10409 Screws
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers

Abstract

An RF Rx module adapted for direct surface mounting to the top surface of the front end of the motherboard of a picocell. The module comprises a printed circuit board having a plurality of direct surface mounted discrete electrical components defining a receive (Rx) section and path for RF signals. The signal receive section is defined by at least the following elements located under a lid which is attached to the surface of the board: a duplexer, a receive low pass filter, a low-noise amplifier, and a receive bandpass filter. At least one aperture in the board is adapted to accept a screw or the like for securing the module to the motherboard of the picocell.

Claims

1. An RF module adapted for direct surface mounting to a front end of a motherboard of a picocell or microcell, said module including a printed circuit board having a plurality of discrete electrical components mounted to a surface thereof and adapted to allow for the reception of cellular signals between the antenna of said picocell or microcell on one end and the respective output pad on said motherboard of said picocell or microcell at the other end.

2. The RF module of claim 1 comprising at least a duplexer, a receive bandpass filter and a low pass filter all direct surface mounted to the surface of said printed circuit board of said module.

3. The RF module of claim 2 further comprising a low-noise amplifier direct surface mounted to the surface of said printed circuit board of said module.

4. The RF module of claim 3 wherein said duplexer, said receive low pass filter, said low-noise amplifier, and said receive bandpass filter define a receive path for RF signals.

5. The RF module of claim 4 further comprising an attenuator pad in said receive path between said receive low pass filter and said low-noise amplifier.

6. The RF module of claim 4 further comprising a lid adapted to cover at least said duplexer, said low-noise amplifier, and said receive bandpass filter.

7. An RF module adapted for direct surface mounting to a front end of a motherboard of a picocellular or microcellular base station and adapted to receive RF signals, the module comprising a circuit board including at least the following discrete electrical components mounted to a surface thereof:

a duplexer, a receive low pass filter, a low-noise amplifier, and a receive bandpass filter.

8. The RF module of claim 7, wherein the RF signals are adapted to pass successively through said duplexer, said receive low pass filter, said low-noise amplifier, and said receive bandpass filter.

9. The RF module of claim 7, wherein said duplexer, said receive bandpass filter, said receive low pass filter, and said low-noise amplifier are all located under a lid attached to the surface of the printed circuit board.

10. The RF module of claim 7, wherein said printed circuit board has a bottom surface having a plurality of electrically conductive pads formed thereon and adapted to allow said printed circuit board to be direct surface mounted to the motherboard of the picocell.

11. An RF module adapted for direct-surface mounting to the front end of the motherboard of a picocell, the module comprising:

a substrate including top and bottom surfaces, the top surface defining a plurality of electrically conductive connection pads, circuit lines, and pins and the bottom surface defining a plurality of electrically conductive connection pads for mounting said module directly to the top surface of the motherboard of the picocell; and

a section on said substrate defining a receive path for RF signals and including at least the following discrete electrical components direct surface mounted to the top surface thereof;

a duplexer, a receive low pass filter, a low-noise amplifier, and a receive bandpass filter.

12. The RF module of claim 11 further comprising a lid attached to the top surface of the substrate and adapted to cover at least said duplexer, said receive bandpass filter, said receive low pass filter, and said low-noise amplifier.