Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof

• US 20080153959A1
• Filed: 03/21/2007
• Published: 06/26/2008
• Est. Priority Date: 12/20/2006
• Status: Abandoned Application

• Current Assignee: SABIC Global Technologies BV (Government of Saudi Arabia)
• Original Assignee: General Electric Company
• Inventors: Ghosh, Soumyadeb, HR, Manjunath, Charati, Sanjay Gurabasappa, Tandon, Kunj, Saak, Jennifer Su
• Application Number:
  US11/689,228
• Publication Number:
  US 20080153959A1
• Time in Patent Office: Days
• US Class Current: 524/404
• CPC Class Codes: C08K 2003/382 and nitrogen
• CPC Class Codes: C08K 3/04 Carbon
• CPC Class Codes: C08K 3/041 Carbon nanotubes
• CPC Class Codes: C08K 3/042 Graphene or derivatives, e.g. graphene oxides
• CPC Class Codes: C08K 3/046 Carbon nanorods, nanowires, nanoplatelets or nanofibres
• CPC Class Codes: C08K 3/38 Boron-containing compounds
• CPC Class Codes: C08L 23/12 Polypropene
• CPC Class Codes: C08L 55/02 ABS [Acrylonitrile-Butadiene-Styrene] polymers
• CPC Class Codes: C08L 69/00 Compositions of polycarbonates; Compositions of derivatives of polycarbonates
• CPC Class Codes: C08L 77/02 Polyamides derived from omega-amino carboxylic acids or from lactams thereof C08L77/10 takes precedence
• CPC Class Codes: Y10T 428/2982 Particulate matter [e.g., sphere, flake, etc.]

Abstract

Disclosed herein is a moldable composition, comprising an organic polymer; a filler composition comprising graphite; and boron nitride, wherein the moldable composition has an electrical resistivity greater than or equal to about 10¹³ ohm/sq, wherein the moldable composition has a melt flow index of about 1 to about 30 grams per 10 minutes when measured at a temperature of 280° C. under a load of 16 kgf/cm². Disclosed herein too is a moldable composition, comprising about 30 to about 85 wt % of an organic polymer; a filler composition, comprising about 10 to about 70 wt % graphite; about 5 to about 60 wt % boron nitride; wherein the moldable composition has a thermal conductivity of about 2 to about 6 Watts per meter-Kelvin; and an electrical resistivity greater than or equal to about 10¹³ ohm/sq.

Claims

1. A moldable composition, comprising:

an organic polymer;

a filler composition comprising;

graphite; and

boron nitride, wherein the moldable composition has an electrical resistivity greater than or equal to about 10¹³ ohm/sq, wherein the moldable composition has a melt flow index of about 1 to about 30 grams per 10 minutes when measured at a temperature of 280°

C. under a load of 16 kgf/cm².

2. The moldable composition of claim 1, having a thermal conductivity of about 2 W/m-K to about 6 W/m-K.

3. The moldable composition of claim 1, having a Class A surface finish.

4. The moldable composition of claim 1, wherein the organic polymer is a thermoplastic resin, a blend of thermoplastic resins, a thermosetting resin, a blend of thermosetting resins, a blend of thermoplastic resins with thermosetting resins, a copolymer, a terpolymer, an oligomer, a homopolymer, a block copolymer, an alternating block copolymer, a random copolymer, a random block copolymer, a graft copolymer, a star block copolymer, a dendrimer, or a combination comprising at least one of the foregoing organic polymers.

5. The moldable composition of claim 1, wherein said organic polymer is a polyacetal, a polyolefin, a polyacrylic, a polycarbonate, a polystyrene, a polyester, a polyamide, a polyamideimide, a polyarylate, a polyarylsulfone, a polyethersulfone, a polyphenylene sulfide, a polyvinyl chloride, a polysulfone, a polyimide, a polyetherimide, a polytetrafluoroethylene, a polyetherketone, a polyether etherketone, a polyether ketone ketone, a polybenzoxazole, a polyphthalide, a polyacetal, a polyanhydride, a polyvinyl ether, a polyvinyl thioether, a polyvinyl alcohol, a polyvinyl ketone, a polyvinyl halide, a polyvinyl nitrile, a polyvinyl ester, polysulfonate, a polysulfide, a polythioester, a polysulfone, a polysulfonamide, polyurea, a polyphosphazene, a polysilazane, a styrene acrylonitrile, a acrylonitrile-butadiene-styrene, or a combination comprising at least one of the foregoing polymers.

6. The moldable composition of claim 1, wherein the organic polymer is a thermosetting resin and wherein the thermosetting resins are polyurethanes, natural rubbers, synthetic rubbers, epoxies, phenolics, silicones, or a combination comprising at least one of the foregoing polymers.

7. The moldable composition of claim 1, wherein the graphite is a crystal vein graphite, a flake graphite, an amorphous graphite, a synthetic graphite, or a combination comprising at least one of the foregoing graphites.

8. The moldable composition of claim 7, wherein the graphite has a particle size of about 1 to about 5000 micrometers.

9. The moldable composition of claim 1, wherein the graphite is present in an amount of 10 wt % to about 30 wt % based on the weight of the moldable composition.

10. The moldable composition of claim 1, wherein the boron nitride is a cubic boron nitride, a hexagonal boron nitride, an amorphous boron nitride, a rhombohedral boron nitride, or a combination comprising at least one of the boron nitrides.

11. The moldable composition of claim 10, wherein the boron nitride has a particle size of about 1 to about 5,000 micrometers.

12. The moldable composition of claim 1, wherein the boron nitride is present in an amount of 5 wt % to about 60 wt % based on the weight of the moldable composition.

18. An article comprising the moldable composition of claim 1.

13. A moldable composition, comprising:

about 30 to about 85 wt % of an organic polymer composition; and

a filler composition, comprising;

about 10 to about 30 wt % graphite;

about 5 to about 60 wt % boron nitride;

wherein all weights are based on the weight of the moldable composition;

wherein the moldable composition has a thermal conductivity of about 2 to about 6 Watts per meter-Kelvin and an electrical resistivity greater than or equal to about 10¹³ ohm/sq.

14. The moldable composition of claim 13, wherein the melt flow index is about 1 to about 30 grams per 10 minutes when measured at a temperature of 280°

C. under a load of 16 kg-f/cm².

15. A method of manufacturing a moldable composition comprising:

melt blending a moldable composition comprising an organic polymer;

a filler composition comprising graphite; and

boron nitride, wherein the moldable composition has an electrical resistivity greater than or equal to about 10¹³ ohm/sq.

16. The method of claim 15, further comprising molding the moldable composition.

17. The method of claim 15, wherein the molding is injection molding.

19. An article comprising the moldable composition of claim 15.

20. An article comprising the moldable composition of claim 17.