Stacked Printed Devices on a Carrier Substrate

• US 20080157267A1
• Filed: 02/28/2007
• Published: 07/03/2008
• Est. Priority Date: 12/29/2006
• Status: Abandoned Application

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Huddleston, Wyatt, Gerber, Mark
• Application Number:
  US11/680,503
• Publication Number:
  US 20080157267A1
• Time in Patent Office: Days
• US Class Current: 257/528
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4824 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73207 Bump and wire connectors
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/19104 on the semiconductor or solid-state device, i.e. passive-on-chip
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 2201/10515 Stacked components
• CPC Class Codes: H05K 2203/013 Inkjet printing, e.g. for printing insulating material or resist
• CPC Class Codes: H05K 2203/049 : Wire bonding
• CPC Class Codes: H05K 3/125 : by ink-jet printing

Abstract

Disclosed herein are systems and methods for stacking passive component devices on a substrate. A conductive material is printed onto a first substrate using a fluid ejection device to form a printed passive device according to a predetermined design. The first substrate is attached to a second substrate, such as a die, to form a component for performing a predetermined function. The component may then be tested to determine whether the component formed according to the predetermined design performs the predetermined function. The design may be adjusted in response to the test to improve the performance of the component in performing the predetermined function. Multiple substrates having printed passive devices may be stacked and electrically connected to the die or other substrate in order to increase the number of devices formed on a particular area of that die or other substrate.

Claims

1. A method for creating a stacked passive device on a semiconductor die, the method comprising:

printing a conductive material onto a first substrate using a fluid ejection printing device to form a printed passive device according to a predetermined design;

attaching the first substrate to a second substrate to form a component for performing a predetermined function;

testing the component to determine whether the component formed according to the predetermined design performs the predetermined function;

adjusting the design in response to the test to improve the performance of an adjusted component in performing the predetermined function;

printing a conductive material on a third substrate using a fluid ejection printing device to form a passive device according to the adjusted design; and

attaching the third substrate to a forth substrate, the third and forth substrate replacing the first and second substrate component for performing the predetermined function.

2. A method according to claim 1, further comprising attaching and electrically connecting the forth substrate to a base substrate.

3. A method according to claim 2, further comprising electrically connecting the third substrate to the base substrate by attaching one end of a wire to the third substrate and the other end of the wire to the base substrate.

4. A method according to claim 1, further comprising encapsulating the third substrate and the fourth substrate.

5. A device made according to the method of claim 1.

6. A device according to claim 5, wherein the first and third substrates are printed passive device carrier substrates and the second and forth substrates are die, and wherein one or more additional printed passive device carrier substrates are formed upon the third passive device carrier substrate and electrically connected to the die.

7. A device comprising:

a first printed passive device carrier substrate having a fluid ejection printed passive device layer, the first printed passive device carrier substrate connected to a die or a base substrate; and

a second printed passive device carrier substrate having a fluid ejection printed passive device layer, the second printed passive device carrier substrate disposed upon the first printed passive device carrier substrate and connected to the first printed passive device carrier substrate, the die, or the base substrate.

8. The device of claim 7, wherein the die is formed on the base substrate and the first printed device is formed on the die.

9. The method according to claim 7, wherein the substrate is an organic substrate.

10. A method for creating a stacked passive device comprising:

printing a pattern of at least one material on a carrier substrate using a fluid ejection device to form one or more printed passive devices,

connecting the printed passive device on the carrier substrate to a die surface; and

environmentally isolating the package having the carrier substrate and die.

11. The method according to claim 10, further comprising attaching the die to a base substrate.

12. The method according to claim 10, wherein connecting comprises physically attaching the carrier substrate to the die and electrically coupling the passive device to an active device on the die.

13. The method according to claim 10, wherein the substrate is an organic substrate.

14. The method according to claim 10, wherein the carrier substrate is a first carrier substrate and further comprising:

printing a pattern of at least one material on a second carrier substrate using a fluid ejection device to form one or more printed passive devices;

attaching the second carrier substrate to the first second carrier substrate; and

electrically connecting the second carrier substrate to the first carrier substrate or the die surface.

15. The method according to claim 11, further comprising electrically connecting the printed passive device to the base substrate.

16. The method according to claim 11, further comprising electrically connecting the die to the base substrate.

17. The method according to claim 10, wherein environmentally isolating the die and passive device comprises encapsulating the die and passive device in an encapsulation layer.

18. The method according to claim 10, wherein printing is performed using a thermal or piezoelectric fluid ejection printing device.

19. The method according to claim 10, wherein the printed pattern consists of multiple overlapping printed layers deposited by the fluid ejection printing device.

20. The method according to claim 11, further comprising testing the electrical properties of the printed pattern using a flying probe tester.