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Stacked Printed Devices on a Carrier Substrate

  • US 20080157267A1
  • Filed: 02/28/2007
  • Published: 07/03/2008
  • Est. Priority Date: 12/29/2006
  • Status: Abandoned Application
First Claim
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1. A method for creating a stacked passive device on a semiconductor die, the method comprising:

  • printing a conductive material onto a first substrate using a fluid ejection printing device to form a printed passive device according to a predetermined design;

    attaching the first substrate to a second substrate to form a component for performing a predetermined function;

    testing the component to determine whether the component formed according to the predetermined design performs the predetermined function;

    adjusting the design in response to the test to improve the performance of an adjusted component in performing the predetermined function;

    printing a conductive material on a third substrate using a fluid ejection printing device to form a passive device according to the adjusted design; and

    attaching the third substrate to a forth substrate, the third and forth substrate replacing the first and second substrate component for performing the predetermined function.

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