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LEADFRAME PACKAGE FOR MEMS MICROPHONE ASSEMBLY

  • US 20080157301A1
  • Filed: 01/03/2007
  • Published: 07/03/2008
  • Est. Priority Date: 01/03/2007
  • Status: Active Grant
First Claim
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1. A cavity semiconductor package comprising:

  • a leadframe having a die pad, a plurality of terminal lands, and an outer frame portion formed with a molding material about the die pad and the terminal lands and leaving portions of the die pad and terminal lands exposed on a top surface and a bottom surface of the leadframe, and an acoustic opening extending through the leadframe permitting through-air transmission of acoustic energy into the cavity semiconductor package.

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