Stacked packages
First Claim
Patent Images
1. A microelectronic assembly comprising:
- a first microelectronic element having a first rear surface;
a second microelectronic element having a second rear surface, the second microelectronic element attached to the first microelectronic element so as to form a stacked package;
wherein the first rear surface of the first microelectronic element faces toward the second rear surface of the second microelectronic element; and
at least one bridging element, wherein the first microelectronic element and second microelectronic element each have a front surface and a plurality of contacts exposed there at, wherein the at least one bridging element extends between the plurality of contacts of the first microelectronic element and the plurality of contacts of the second microelectronic element so as to electrically connect the two.
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Abstract
A microelectronic assembly that includes a first microelectronic element having a first rear surface. The assembly further includes a second microelectronic element having a second rear surface. The second microelectronic element is attached to the first microelectronic element so as to form a stacked package. The first rear surface of the first microelectronic element faces toward the second rear surface of the second microelectronic element.
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Citations
19 Claims
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1. A microelectronic assembly comprising:
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a first microelectronic element having a first rear surface; a second microelectronic element having a second rear surface, the second microelectronic element attached to the first microelectronic element so as to form a stacked package; wherein the first rear surface of the first microelectronic element faces toward the second rear surface of the second microelectronic element; and at least one bridging element, wherein the first microelectronic element and second microelectronic element each have a front surface and a plurality of contacts exposed there at, wherein the at least one bridging element extends between the plurality of contacts of the first microelectronic element and the plurality of contacts of the second microelectronic element so as to electrically connect the two. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of assembling a stacked microelectronic assembly comprising the steps of:
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forming a microelectronic assembly by stacking a first subassembly including a plurality of microelectronic elements onto a second subassembly including a plurality of microelectronic elements, wherein the rear faces of the first subassembly and second subassembly confront one another; electrically connecting a plurality of contacts exposed at a front face of the first subassembly to a plurality of contacts exposed at a front face of the second subassembly. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification