×

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING IMPROVED REACTION BARRIER LAYERS

  • US 20080157395A1
  • Filed: 12/28/2006
  • Published: 07/03/2008
  • Est. Priority Date: 12/28/2006
  • Status: Active Grant
First Claim
Patent Images

1. In an interconnection structure suitable for flip-chip attachment of microelectronic device chips to chip carriers, a three-layer ball limiting metallurgy comprising:

  • an adhesion layer for deposition on a wafer or substrate;

    a solder reaction barrier layer of a material selected from the group consisting of Ni, Co, Ru, W, V, Nb, Hf, Mo and their alloys; and

    a solder wettable layer.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×