Development of a low driving-voltage micro scratch drive actuator by ultra-low resistivity silicon wafer

• US 20080157625A1
• Filed: 04/27/2007
• Published: 07/03/2008
• Est. Priority Date: 12/28/2006
• Status: Abandoned Application

• Current Assignee: Sunonwealth Electric Machine Industry Company Limited
• Original Assignee: Sunonwealth Electric Machine Industry Company Limited
• Inventors: Lee, Yen-Chi, Lin, Chun-Ying, Horng, Alex, Huang, I-Yu
• Application Number:
  US11/790,718
• Publication Number:
  US 20080157625A1
• Time in Patent Office: Days
• US Class Current: 310/300
• CPC Class Codes: H02K 7/14 Structural association with mechanical loads, e.g. with hand-held machine tools or fans with fan or impeller for cooling the machine H02K9/06
• CPC Class Codes: H02N 1/002 Electrostatic motors

Abstract

Based on the voltage-division theory, this invention proposes a new method to decrease the driving voltage of the micro scratch drive actuator (SDA) by using an ultra-low resistivity silicon wafer as substrate. This patent has compared two SDA actuators with the same layout and fabricating processes but under different resistivity of substrate. The SDA fabricated on the ultra-low resistivity silicon wafer has demonstrated a lower driving voltage of only about 4˜12 V_o-p. However, the conventional SDA using normal silicon wafer needs higher driving voltage (30˜75 V_o-p), thus has lower probability for commercial applications. On the other hand, this invention presents a new SDA process to overcome the inherent 2 μm line-width limitation of conventional mask aligner with 4360 Å UV wavelength light source (g-line) and further to reduce the driving voltage of SDA.

Claims

1. An innovative material and process used to reduce the driving voltage of micro scratch drive actuators, includes

a. Adopting an ultra-low resistivity silicon wafer as the new substrate material of SDA device.

b. Decreasing the line-width of the bushing and supporting beam of SDA by adding an additional deposition process in normal SDA process to overcome the inherent line-width limitation (2 μ

m) of conventional g-line mask aligner.

3. The ultra-low-resistivity silicon wafer mentioned in claim 1 refers that its resistivity is under the range of 0.001˜

0.004 Ω

-cm.

4. The SDA device with the novel material and process as mentioned in claim 1 can be applied to the development of SDA micro motor.

6. The SDA device with the novel material and process as mentioned in claim 1 can be applied to the development of SDA-based micro fan.

8. The SDA device with the novel material and process as mentioned in claim 1 can be applied to the development of micro thermal module/system assembly.

10. The SDA device with the novel material and process as mentioned in claim 1 can be applied to the development of micro device/structure assembly.

12. The SDA device with the novel material and process as mentioned in claim 1 can be applied to the development of micro fluid system.

14. The SDA device with the novel material and process as mentioned in claim 1 can be applied to the development of optical/telecommunication micro switch.

2. An innovative layout of micro scratch drive actuators includes

a. At least three new shapes of SDA plate, including the triangle SDA plate with etch-holes design, rectangle SDA plate with etch-holes design and hexagonal SDA plate with etch-holes design. Once the etch holes added to the layout of conventional SDA plate, the releasing of structure layer can be accelerated and the accumulated residual charges in the front end of SDA plate is reduced.

b. At least four different length/width ratios of SDA-plate have been designed in this patent, including 58 μ

m/60 μ

m, 68 μ

m/60 μ

m, 78 μ

m/60 μ

m and 78 μ

m/65 μ

m.

5. The SDA device with the novel layout designs as mentioned in claim 2 can be applied to the development of SDA micro motor.

7. The SDA device with the novel layout designs as mentioned in claim 2 can be applied to the development of SDA-based micro fan.

9. The SDA device with the novel layout designs as mentioned in claim 2 can be applied to the development of micro thermal module/system assembly.

11. The SDA device with the novel layout designs as mentioned in claim 2 can be applied to the development of micro device/structure assembly.

13. The SDA device with the novel layout designs as mentioned in claim 2 can be applied to the development of micro fluid system.

15. The SDA device with the novel layout designs as mentioned in claim 2 can be applied to the development of optical/telecommunication micro switch.