Electric circuit device and the manufacturing method

• US 20080158824A1
• Filed: 12/19/2007
• Published: 07/03/2008
• Est. Priority Date: 12/27/2006
• Status: Active Grant

• Current Assignee: Aisin AW Company Limited (Aisin Corp.), Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Aisin AW Company Limited (Aisin Corp.), Fuji Electric Device Technology Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Aoki, Kazuo, Soyano, Shin, Tsuruoka, Junji, Yasui, Seiji, Kabata, Yasushi
• Granted Patent: US 7,663,886 B2
• Time in Patent Office: Days
• US Class Current: 361/711
• CPC Class Codes: H01L 2224/37099 Material
• CPC Class Codes: H01L 2224/40137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/83801 Soldering or alloying
• CPC Class Codes: H01L 2224/84801 Soldering or alloying
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 24/40 of an individual strap connector
• CPC Class Codes: H01L 24/84 using a strap connector
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/10924 Leads formed from a punched metal foil
• CPC Class Codes: H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 3/0061 : onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: Y10T 29/49126 : Assembling bases

Abstract

An electronic circuit device includes a lower-side substrate formed with a main circuit; an upper-side substrate formed with a drive control circuit that drivingly controls the main circuit; a support body positionally fixed above the lower-side substrate with resin in a hardened state; and a case having a peripheral portion with an outer surface that has at least a portion of an external lead-out terminal of the drive control circuit and the main circuit thereon, and a substrate storage space that accommodates the lower-side substrate on a side inward from the peripheral portion.

Claims

1. An electronic circuit device, comprising:

a lower-side substrate formed with a main circuit;

an upper-side substrate formed with a drive control circuit that drivingly controls the main circuit;

a support body positionally fixed above the lower-side substrate with resin in a hardened state; and

a case having a peripheral portion with an outer surface that has at least a portion of an external lead-out terminal of the drive control circuit and the main circuit thereon, and a substrate storage space that accommodates the lower-side substrate on a side inward from the peripheral portion, wherein;

the lower-side substrate is accommodated inside the substrate storage space in an arrangement where the upper-side substrate is positioned over at least a portion of the lower-side substrate,

a space over the lower-side substrate is filled with a filling material that is formed from a resin, and

the upper-side substrate is supported and fixed by the support body.

2. The electronic circuit device according to claim 1, further comprising:

a support frame integrated with the case that bridges across the substrate storage space between the lower-side substrate and the upper-side substrate, wherein;

the support body is positionally fixed by the resin in the hardened state through the support frame.

3. The electronic circuit device according to claim 2, wherein a plurality of the lower-side substrates is provided juxtaposed, and the support body is positioned over a space between different lower-side substrates.

4. The electronic circuit device according to claim 3, wherein a lead pin that extends from the lower-side substrate toward the upper-side substrate is positioned by the support frame.

5. The electronic circuit device according to claim 4, wherein a positioning portion in the support frame for the lead pin is provided adjacent to a positioning portion in the support frame for the support body.

6. The electronic circuit device according to claim 5, wherein the support frame contacts a lead frame that connects the external lead-out terminal and the main circuit formed on the lower-side substrate.

7. The electronic circuit device according to claim 6, wherein:

a portion of the upper-side substrate is formed as a weight placement portion on which a weight is placed, and

a weight location support body is provided that mainly supports the weight from the weight placement portion.

8. The electronic circuit device according to claim 7, wherein:

the main circuit is a power circuit that is formed by mounting a power semiconductor element on an insulated substrate,

the drive control circuit is a drive control circuit that mounts a circuit component on a print circuit board, and

the lower-side substrate formed with the power circuit is mounted and positionally fixed on a metal base plate for heat radiation, and the case is positionally fixed by the metal base plate.

9. The electronic circuit device according to claim 2, wherein a lead pin that extends from the lower-side substrate toward the upper-side substrate is positioned by the support frame.

10. The electronic circuit device according to claim 9, wherein a positioning portion in the support frame for the lead pin is provided adjacent to a positioning portion in the support frame for the support body.

11. The electronic circuit device according to claim 10, wherein the support frame contacts a lead frame that connects the external lead-out terminal and the main circuit formed on the lower-side substrate.

12. The electronic circuit device according to claim 2, wherein the support frame contacts a lead frame that connects the external lead-out terminal and the main circuit formed on the lower-side substrate.

13. The electronic circuit device according to claim 1, wherein:

a portion of the upper-side substrate is formed as a weight placement portion on which a weight is placed, and

a weight location support body is provided that mainly supports the weight from the weight placement portion.

14. The electronic circuit device according to claim 1, wherein:

the main circuit is a power circuit that is formed by mounting a power semiconductor element on an insulated substrate,

the drive control circuit is a drive control circuit that mounts a circuit component on a print circuit board, and

the lower-side substrate formed with the power circuit is mounted and positionally fixed on a metal base plate for heat radiation, and the case is positionally fixed by the metal base plate.

15. A manufacturing method for an electronic circuit device comprising a lower-side substrate formed with a main circuit;

an upper-side substrate formed with a drive control circuit that drivingly controls the main circuit; and

a case having a peripheral portion with an outer surface that has at least a portion of an external lead-out terminal of the drive control circuit and the main circuit thereon, and a substrate storage space that accommodates the lower-side substrate on a side inward from the peripheral portion, wherein the lower-side substrate is accommodated inside the substrate storage space in an arrangement where the upper-side substrate is positioned over at least a portion of the lower-side substrate, and at least a space over the lower-side substrate is filled with a filling material, the manufacturing method comprising the steps of;

pouring a resin serving as the filling material between the lower-side substrate and a support body in a support body positioned state where the support body that supports the upper-side substrate is positioned over the lower-side substrate, which is positioned within the substrate storage space;

hardening the poured resin and positionally fixing the support body over the lower-side substrate; and

fixing the upper-side substrate on the positionally fixed support body.

16. The manufacturing method according to claim 15, wherein:

a support frame bridging the substrate storage space is integrated with the case, and

the support body positioned state is achieved by using the support body to position the support frame in a lower-side substrate storage state where the lower-side substrate is accommodated within the substrate storage space.

17. The manufacturing method according to claim 16, wherein the main circuit is a power circuit that is formed by mounting a power semiconductor element on an insulated substrate, the drive control circuit is a drive control circuit that mounts a circuit component on a print circuit board, and

the lower-side substrate formed with the power circuit is mounted and positionally fixed on a metal base plate for heat radiation, and the case is positionally fixed by the metal base plate.

18. The manufacturing method according to claim 15, wherein:

the main circuit is a power circuit that is formed by mounting a power semiconductor element on an insulated substrate,

the drive control circuit is a drive control circuit that mounts a circuit component on a print circuit board, and

the lower-side substrate formed with the power circuit is mounted and positionally fixed on a metal base plate for heat radiation, and the case is positionally fixed by the metal base plate.

19. The manufacturing method according to claim 15, wherein:

a portion of the upper-side substrate is formed as a weight placement portion on which a weight is placed, and

a weight location support body is provided that mainly supports the weight from the weight placement portion.

20. The manufacturing method according to claim 16, wherein the support frame is provided contacting a lead frame that connects the external lead-out terminal and the main circuit formed on the lower-side substrate.