PROCESSOR APPARATUS

• US 20080158829A1
• Filed: 01/18/2008
• Published: 07/03/2008
• Est. Priority Date: 05/20/1992
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Wakabayashi, Kenichi, Takayama, Chitoshi, Shiozaki, Tadashi
• Granted Patent: US 7,583,505 B2
• Time in Patent Office: Days
• US Class Current: 361/719
• CPC Class Codes: B41J 29/377 Cooling or ventilating arrangements
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07735 the record carrier comprising means for protecting against electrostatic discharge
• CPC Class Codes: G06K 19/07741 comprising a first part operating as a regular record carrier and a second attachable part that changes the functional appearance of said record carrier, e.g. a contact-based smart card with an adapter part which, when attached to the contact card makes the contact card function as a non-contact card
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: H05K 5/0208 Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof
• CPC Class Codes: H05K 5/0256 of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff

Abstract

An add-on cartridge structure for electronic devices having a housing formed from upper and lower case sections. The upper case is typically made from plastic and has a conductive layer formed on inside surfaces, while the lower case is made from a metallic material such as aluminum. A wall-like mating member is disposed on an outer edge of the lower case, and mates with the sides of the upper case to form a nearly rectangular cross section housing. The double conductive layer formed by the outside surface of the mating member and the inside surface of the upper case prevents leakage of electromagnetic radiation from the cartridge. Furthermore, high frequency noise is prevented by grounding both the signal ground of the printed circuit board and the frame ground at multiple locations. The conductive layer has a surface break caused by a through-hole through which the printed circuit board plug protrudes to the outside. Such an opening tends to allow electromagnetic noise to leak outside of the casing, but by grounding the signal and frame grounds at locations near the ends and middle of the plug, harmful noise from electromagnetic radiation is reduced.

Claims

1-3. -3. (canceled)

4. An apparatus comprising:

a case comprising air passages;

a heat dissipation plate structure comprising a thermally conductive material within the case;

a processor comprising a major surface, wherein said processor generates heat when energized, and wherein the heat dissipation plate structure is adapted to dissipate heat from the processor;

an array of pins, wherein the pins in the array of pins are substantially perpendicular to the major surface of the processor and are operatively coupled to the processor;

a socket assembly;

a circuit board, wherein the socket assembly is on the circuit board,

wherein the pins in the array of pins are configured to be received in the socket assembly.

5. The apparatus of claim 4 further comprising a biasing element operatively coupled to the processor.

6. The apparatus of claim 4 wherein the processor is a microprocessor.

7. The apparatus of claim 4 wherein the heat dissipation plate structure comprises aluminum.

8. The apparatus of claim 4 wherein the processor is a RISC type processor.

9. The apparatus of claim 4 wherein the processor operates at a frequency of 25 MHz or more.

10. The apparatus of claim 4 wherein the plate structure comprises a side portion that faces the processor.

11. The apparatus of claim 4 further comprising a conductive structure mechanically coupled to the processor, and wherein the conductive structure forms an electromagnetic shield for the processor.

12. The apparatus of claim 4 further comprising a conductive structure mechanically coupled to the processor, wherein the conductive structure forms an electromagnetic shield for the processor, and wherein the conductive structure is grounded to the circuit board.

13. The apparatus of claim 4 wherein the pins are only at a peripheral region of the processor.

14. The apparatus of claim 4 wherein the apparatus is a computer.

15. The apparatus of claim 4 wherein the apparatus is a printer.

16. The apparatus of claim 4 comprising a biasing element comprising a pushing element operatively coupled to the processor.

17. The apparatus of claim 4 wherein the air passages are in the form of slots.

18. The apparatus of claim 14 wherein the plate structure comprises a side portion that faces the processor.