MODULE
First Claim
Patent Images
1. A module comprising:
- a board having an upper surface and a lower surface opposite to the upper surface, the board having a through-hole provided therein, the though-hole communicating with the upper surface and the lower surface;
an auxiliary board having a upper surface and a lower surface opposite to the upper surface of the auxiliary board, the upper surface of the auxiliary board being situated on the lower surface of the board, the auxiliary board including a sealing portion sealing the through-hole;
a first electronic component mounted on the upper surface of the board;
a conductive cover covering the first electronic component; and
a second electronic component mounted on the upper surface of the auxiliary board, the second electronic component positioned in the through-hole in the board, the second electronic component being taller than the first electronic component.
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Accused Products
Abstract
A module includes a board having a through-hole provided therein, an auxiliary board provided on a lower surface of the board, a first electronic component mounted on an upper surface of the board, a conductive cover covering the first electronic component, and a second electronic component mounted on an upper surface of the auxiliary board. The auxiliary board includes a sealing portion sealing the through-hole. The second electronic component is positioned in the through-hole provided in the board and on the upper surface of the auxiliary board. The second electronic component is taller than the first electronic component. This module is thin.
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Citations
16 Claims
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1. A module comprising:
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a board having an upper surface and a lower surface opposite to the upper surface, the board having a through-hole provided therein, the though-hole communicating with the upper surface and the lower surface; an auxiliary board having a upper surface and a lower surface opposite to the upper surface of the auxiliary board, the upper surface of the auxiliary board being situated on the lower surface of the board, the auxiliary board including a sealing portion sealing the through-hole; a first electronic component mounted on the upper surface of the board; a conductive cover covering the first electronic component; and a second electronic component mounted on the upper surface of the auxiliary board, the second electronic component positioned in the through-hole in the board, the second electronic component being taller than the first electronic component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification