Heat transfer device in a rotating structure

• US 20080159853A1
• Filed: 01/03/2007
• Published: 07/03/2008
• Est. Priority Date: 01/03/2007
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Khanna, Vijayeshwar D., Sri-Jayantha, Sri M., McVicker, Gerard
• Granted Patent: US 7,896,611 B2
• Time in Patent Office: Days
• US Class Current: 415/178
• CPC Class Codes: F04D 25/04 the pump being fluid-driven pumps driven by exhaust gases F02B37/00, F02B39/00; turbochargers F02C6/12
• CPC Class Codes: F04D 29/582 specially adapted for elastic fluid pumps
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: Y10T 29/49236 Fluid pump or compressor making

Abstract

A cooling system includes a moving rotor system which in turn includes: a disk on which a plurality of heat conducting structures are distributed, the heat conducting structures having a cross section optimized for maximum surface area to footprint area; the heat conducting structures having a shape to optimize the heat transfer coefficient between the structures moving through the ambient fluid; and a mechanism for generating a mass fluid flow over the conducting structures so that the heat conducting structures are persistently cooled.

Claims

1. A cooling system comprising:

a moving rotor system comprising;

a disk on which a plurality of heat conducting structures are distributed, the heat conducting structures having a cross section optimized for maximum surface area to footprint area;

the heat conducting structures having a shape to optimize the heat transfer coefficient between the structures moving through the ambient fluid; and

a mechanism for generating a mass fluid flow over the heat conducting structures so that the heat conducting structures are persistently cooled.

2. The cooling system of claim 1 where the heat conducting structures comprise a fin shape.

3. The cooling system of claim 2 where the fin shape has a circular cross section.

4. The cooling system of claim 2 where the fin shape has a rectangular cross section.

5. The cooling system of claim 1 where the fan blades are arranged in a spiral pattern.

6. The cooling system of claim 2 where the fin shape has an irregular cross section.

7. The cooling system of claim 2 where the cooling structures comprise a circular fin pattern.

8. The cooling system of claim 2 wherein the fan blades are arranged in a cascading fin pattern.

9. The cooling system of claim 1 where the mechanism for moving the air comprises a baffle to reduce a swirl component of the fluid.

10. The cooling system of claim 1 where the heat conducting structures comprise a pin shape.

11. The cooling system of claim 1 where the mechanism for generating mass fluid flow is an externally mounted fluid supply.

12. The cooling system of claim 1 where the mechanism for generating mass fluid flow is a pressurized system, comprising a shroud, a radial mounted fan, and an axial out exhaust.

13. The cooling system of claim 11 where a fan blade mounted centrally to the disk self-generates an axial in, radial out fluid flow.

14. The cooling system of claim 11 where the externally mounted air supply is a fan or rotor system.

15. A cooling system comprising:

a moving rotor system comprising;

a disk on which a plurality of heat conducting structures are distributed, the heat conducting structures having a cross section optimized for maximum surface area to footprint area;

the heat conducting structures having a shape to optimize the heat transfer coefficient between the structures moving through the ambient fluid;

a mechanism for generating a mass fluid flow over the conducting structures so that the heat conducting structures are persistently cooled; and

a mechanism to direct mass fluid flow radial out of system, thereby reducing a swirl component of fluid.

16. The cooling system of claim 15 where the mechanism to direct the mass fluid flow has multiple radial instantiations.

17. The cooling system of claim 16 where each radial instantiation is a comb-like structure which enhances heat dissipation by stripping the fluid boundary layer as each fin moves through.

18. The cooling system of claim 15 where the mechanism to direct mass fluid flow radially out of the system, thereby reducing the swirl component of fluid, comprises a set of baffles.

19. The cooling system of claim 15 where the mechanism for generating a mass fluid flow over the conducting structures so that the heat conducting structures are persistently cooled comprises a fan exterior to the cooling system.

20. The cooling system of claim 15 where the mechanism for generating a mass fluid flow comprises a baffle to reduce the swirl component of the fluid.