Circuit board unit and method for production thereof
First Claim
1. A method of producing a circuit board unit comprising the steps of:
- producing a circuit board topmost laminate with conductive tracks on the upper side for mounting surface-mountable devices in a thickness dimensioned such that an estimated heat dissipated by the surface-mountable devices is transported from the upper side to the underside of the circuit board topmost laminate;
arranging under the circuit board topmost laminate an insulation laminate;
embedding in the insulation laminate at sites below surface-mountable devices with high heat dissipation, inserts made of a material with good heat conductivity and electrical insulation; and
arranging below the insulation laminate and the inserts a cooling plate.
2 Assignments
0 Petitions
Accused Products
Abstract
The invention relates to a circuit board unit and a method for production thereof. The circuit board unit comprises a circuit board topmost laminate with conductive tracks on the upper side for mounting surface-mountable devices. The circuit board topmost laminate features a thickness dimensioned such that the anticipated heat dissipated by the surface-mountable devices is transported from the upper side to the underside of the circuit board laminate to good effect. The circuit board unit further comprises an electrically insulating laminate arranged under the circuit board topmost laminate, inserts made of a material with good heat conductivity and electrical insulation embedded in the electrically insulating laminate at sites below surface-mountable devices with high heat dissipation, and a cooling plate arranged below the electrically insulating laminate and the inserts.
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Citations
55 Claims
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1. A method of producing a circuit board unit comprising the steps of:
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producing a circuit board topmost laminate with conductive tracks on the upper side for mounting surface-mountable devices in a thickness dimensioned such that an estimated heat dissipated by the surface-mountable devices is transported from the upper side to the underside of the circuit board topmost laminate; arranging under the circuit board topmost laminate an insulation laminate; embedding in the insulation laminate at sites below surface-mountable devices with high heat dissipation, inserts made of a material with good heat conductivity and electrical insulation; and arranging below the insulation laminate and the inserts a cooling plate. - View Dependent Claims (2, 6, 10, 11, 12, 14, 15, 17, 20)
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3. (canceled)
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25. A circuit board unit comprising:
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a circuit board topmost laminate with conductive tracks on the upper side for mounting surface-mountable devices in a thickness dimensioned such that an estimated heat dissipated by the surface-mountable devices is transported from the upper side to the underside of the circuit board topmost laminate; an electrically insulating laminate arranged under the circuit board topmost laminate; inserts made of a material with good heat conductivity and electrical insulation embedded in the electrically insulating laminate at sites below surface-mountable devices with high heat dissipated; and a cooling plate arranged below the electrically insulating laminate and the inserts. - View Dependent Claims (26, 28, 32, 35, 36)
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27. (canceled)
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37. A circuit board module comprising:
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two circuit board units, each including a circuit board topmost laminate with conductive tracks on the upper side for mounting surface-mountable devices in a thickness dimensioned such that an estimated heat dissipated by the surface-mountable devices is transported from the upper side to the underside of the circuit board topmost laminate; an electrically insulating laminate arranged under the circuit board topmost laminate; inserts made of a material with good heat conductivity and electrical insulation embedded in the electrically insulating laminate at sites below surface-mountable devices with high heat dissipated; and a cooling plate arranged below the electrically insulating laminate and the inserts; wherein the two circuit board units and additional sidewalls form the circuit board module, the circuit board units are directly electrically interconnected by surface-mountable device connectors and the electrical inputs and outputs are ported through the sidewalls by hermetically sealed electrical connections. - View Dependent Claims (38, 39, 40, 44, 46, 49, 50, 51, 54, 55)
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41. (canceled)
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53. (canceled)
Specification