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Three-Dimensional Mask-Programmable Memory Module

  • US 20080162850A1
  • Filed: 01/22/2008
  • Published: 07/03/2008
  • Est. Priority Date: 04/04/2004
  • Status: Abandoned Application
First Claim
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1. A three-dimensional mask-programmable memory (3D-mM) module, comprising:

  • a 3D-mM chip, wherein said 3D-mM chip comprises a plurality of vertically stacked 3D-mM memory levels and stores a pre-recorded multimedia library (PML); and

    a usage-control block for controlling the usage of said PML.

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