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METHODS, DESIGNS, DEFECT REVIEW TOOLS, AND SYSTEMS FOR DETERMINING LOCATIONS ON A WAFER TO BE REVIEWED DURING DEFECT REVIEW

  • US 20080163140A1
  • Filed: 12/05/2007
  • Published: 07/03/2008
  • Est. Priority Date: 12/06/2006
  • Status: Active Grant
First Claim
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1. A computer-implemented method for determining locations on a wafer to be reviewed during defect review, comprising:

  • acquiring coordinates of defects detected by two or more inspection systems, wherein the defects do not comprise defects detected on the wafer; and

    determining coordinates of the locations on the wafer to be reviewed during the defect review by translating the coordinates of the defects into the coordinates on the wafer such that results of the defect review performed at the locations can be used to determine if the defects cause systematic defects on the wafer.

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