Light Emitting Apparatus

• US 20080164484A1
• Filed: 03/08/2006
• Published: 07/10/2008
• Est. Priority Date: 03/14/2005
• Status: Active Grant

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: Lee, Jae Hong
• Granted Patent: US 9,859,259 B2
• Time in Patent Office: Days
• US Class Current: 257/89
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

The present invention provides a light emitting apparatus comprising a three-color light emitting device unit including at least three light emitting diode (LED) chips for respectively emitting red, green and blue light; a white light emitting device unit including at least one blue LED chip with a fluorescent substance formed thereon; and a substrate provided with a first electrode connected in common to ends of the LED chips and second electrodes formed to correspond respectively to the LED chips. Further, the present invention provides a light emitting apparatus comprising a plurality of LED chips; a substrate provided with a first electrode connected in common to ends of the plurality of LED chips and second electrodes formed to correspond respectively to the plurality of LED chips; an upper package formed on the substrate to surround the plurality of LED chips and to have a partition crossing the first electrode at the center of the upper package; and a molding member that encapsulates the plurality of LED chips and is divided by the partition of the upper package.

Claims

1. A light emitting apparatus, comprising:

a three-color light emitting device unit including at least three light emitting diode (LED) chips for respectively emitting red, green and blue light;

a white light emitting device unit including at least one blue LED chip with a fluorescent substance formed thereon; and

a substrate provided with a first electrode connected in common to ends of the LED chips and second electrodes formed to correspond respectively to the LED chips.

2. The apparatus as claimed in claim 1, wherein the fluorescent substance is dotted with a predetermined thickness to surround top and side surfaces of the blue LED chip of the white light emitting device unit.

3. The apparatus as claimed in claim 1, further comprising an upper package formed on the substrate to surround the LED chips and to have a predetermined inclination at an inner wall of the upper package.

4. The apparatus as claimed in claim 1, further comprising a molding member made of a transparent resin for encapsulating the LED chips.

9. The apparatus as claimed in claim 1, wherein electrical connection is selectively made in the three-color light emitting device unit to emit respective light with seven colors.

10. The apparatus as claimed in claim 2, wherein electrical connection is selectively made in the three-color light emitting device unit to emit respective light with seven colors.

11. The apparatus as claimed in claim 3, wherein electrical connection is selectively made in the three-color light emitting device unit to emit respective light with seven colors.

12. The apparatus as claimed in claim 4, wherein electrical connection is selectively made in the three-color light emitting device unit to emit respective light with seven colors.

5. A light emitting apparatus, comprising:

a plurality of LED chips;

a substrate provided with a first electrode connected in common to ends of the plurality of LED chips and second electrodes formed to correspond respectively to the plurality of LED chips;

an upper package formed on the substrate to surround the plurality of LED chips and to have a partition crossing the first electrode at the center of the upper package; and

a molding member for encapsulating the plurality of LED chips,

wherein the molding member is divided by the partition of the upper package.

6. The apparatus as claimed in claim 5, wherein the plurality of LED chips are divided by the partition and positioned in at least two regions.

7. The apparatus as claimed in claim 5, wherein the plurality of LED chips are divided by the partition into a three-color light emitting device unit and a white light emitting device unit, the three-color light emitting device unit having at least three LED chips for respectively emitting red, green and blue light, the white light emitting device unit having at least one blue LED chip with a fluorescent substance formed thereon.

8. The apparatus as claimed in claim 5, wherein an inner wall of the upper package is formed to have a predetermined inclination.

13. The apparatus as claimed in claim 7, wherein electrical connection is selectively made in the three-color light emitting device unit to emit respective light with seven colors.

14. The apparatus as claimed in claim 8, wherein electrical connection is selectively made in the three-color light emitting device unit to emit respective light with seven colors.