CERAMIC PACKAGE FOR LED

• US 20080164487A1
• Filed: 02/15/2007
• Published: 07/10/2008
• Est. Priority Date: 01/08/2007
• Status: Abandoned Application

• Current Assignee: Ledtech Electronics Corp.
• Original Assignee: Ledtech Electronics Corp.
• Inventors: SU, Chih-Liang, WANG, Yao-I, LIU, Hsin-Chun, WANG, Fang-Po
• Application Number:
  US11/675,264
• Publication Number:
  US 20080164487A1
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A ceramic light emitted diode (LED) package has a pair of discrete reflection walls to reflect light emission from the LED. With two opposite reflection walls and two opposite openings around the LED, light emitted from the LED package can be fanned out.

Claims

1. A ceramic LED package, comprising:

a first ceramic substrate comprising;

a first side having a first metal area and a second metal area;

a second side having a third metal area and a fourth metal area;

a first connecting metal coupling said first metal area to said third metal area; and

a second connecting metal coupling said second metal area to said fourth metal area;

a second ceramic substrate laminated on said first ceramic substrate and comprising a pair of discrete reflection walls; and

a light emitting diode (LED) mounted on said first ceramic substrate and having electrodes respectively coupled to said first metal area and said second metal area, said LED being mounted between said reflection walls.

2. A ceramic LED package as claimed in claim 1, wherein said coupling between at least one of the electrodes and the respective metal area is wire bonding.

3. A ceramic LED package as claimed in claim 1, wherein said coupling between at least one of the electrodes and the respective metal area is flip chip bonding.

4. A ceramic LED package as claimed in claim 1, wherein said reflection walls are inclined surfaces.

5. A ceramic LED package as claimed in claim 1, further comprising:

transparent glue sealed in between said walls.

6. A ceramic LED assembly, comprising multiple ceramic LED packages each being as claimed in claim 1, wherein said packages are serially connected.

7. A ceramic LED assembly, comprising multiple ceramic LED packages each being as claimed in claim 1, wherein said packages are connected in parallel.

8. A ceramic LED package as claimed in claim 1, wherein at least one of said connecting metals is a metal wall of a through hole.

9. A ceramic LED package as claimed in claim 1, wherein at least one of said connecting metals is a metal-filled through hole.

10. A ceramic LED package as claimed in claim 1, wherein said first connecting metal is located at an edge of said first ceramic substrate.

11. A ceramic LED package as claimed in claim 1, wherein said second connecting metal is located at an edge of said first ceramic substrate.

12. A method of manufacturing a ceramic LED package, said method comprising:

preparing a first ceramic substrate, said first ceramic substrate comprising;

a first side having a first metal area and a second metal area;

a second side having a third metal area and a fourth metal area;

a first connecting metal coupling said first metal area to said third metal area; and

a second connecting metal coupling said second metal area to said fourth metal area;

laminating a second ceramic substrate on said first ceramic substrate, said second ceramic substrate comprising a pair of discrete reflection walls; and

mounting a light emitting diode (LED) on said first ceramic substrate so that electrodes of said LED are respectively coupled to said first metal area and said second metal area;

wherein said LED is mounted between said reflection walls.

13. The method as claimed in claim 12, further comprising:

a transparent glue sealing process to protect said LED.

14. The method as claimed in claim 12, wherein at least one of said connecting metals is a metal wall of a through hole.

15. The method as claimed in claim 12, wherein at least one of said connecting metals is a metal filled in a through hole.

16. The method as claimed in claim 12, further comprising:

a cutting process to obtain a plurality of serially connected packages.

17. The method as claimed in claim 12, further comprising:

a cutting process to obtain a plurality of packages connected in parallel.

18. The method as claimed in claim 16, wherein said cutting process comprises cutting along said first connecting metal.

19. The method as claimed in claim 16, wherein said cutting process comprises cutting along said second connecting metal.