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CERAMIC PACKAGE FOR LED

  • US 20080164487A1
  • Filed: 02/15/2007
  • Published: 07/10/2008
  • Est. Priority Date: 01/08/2007
  • Status: Abandoned Application
First Claim
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1. A ceramic LED package, comprising:

  • a first ceramic substrate comprising;

    a first side having a first metal area and a second metal area;

    a second side having a third metal area and a fourth metal area;

    a first connecting metal coupling said first metal area to said third metal area; and

    a second connecting metal coupling said second metal area to said fourth metal area;

    a second ceramic substrate laminated on said first ceramic substrate and comprising a pair of discrete reflection walls; and

    a light emitting diode (LED) mounted on said first ceramic substrate and having electrodes respectively coupled to said first metal area and said second metal area, said LED being mounted between said reflection walls.

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