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Electric power converter and mounting structure of semiconductor device

  • US 20080164607A1
  • Filed: 03/11/2008
  • Published: 07/10/2008
  • Est. Priority Date: 08/21/2003
  • Status: Active Grant
First Claim
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1. A mounting structure of a semiconductor device, the structure comprising:

  • a semiconductor module including a semiconductor element for supplying electricity, a first and a second electrode plates disposed on both sides of the semiconductor element, a connecting terminal connected to a control circuit for controlling the semiconductor element, and a resin mold having electric insulation for sealing the semiconductor element and the first and the second electrode plates; and

    a first and a second holding members having electric conductivity for holding the semiconductor module from both sides of the semiconductor module through a first and a second insulation members as a dielectric member, whereinthe first or second electrode plate, the first or second holding member, the first or second insulation member provide a bypass capacitor for reducing noise.

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