BACKPLANES FOR ELECTRO-OPTIC DISPLAYS
First Claim
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1. A process for forming a backplane for an electro-optic display, the process comprising:
- providing a substrate;
forming spaced first, second and third electrodes on the substrate;
thereafter forming a sacrificial layer on the substrate, the sacrificial layer covering the first and second electrodes but leaving at least part of the third electrode exposed;
thereafter depositing conductive material on to the substrate so as to form a cantilever beam member having a first section contacting the exposed part of the third electrode, and a second section extending over the sacrificial layer so as to extend over at least part of each of the second and first electrodes; and
thereafter removing the sacrificial layer, thereby leaving the second section of the cantilever beam member free to into and out of contact with the first electrode under the influence of a voltage applied to the second electrode.
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Abstract
A backplane for an electro-optic display comprises a pixel electrode (104), a voltage supply line (C) arranged to supply a voltage to the pixel electrode (104), and a micromechanical switch (106, 112) disposed between the voltage supply line (C) and the pixel electrode (104), the micromechanical switch (106, 112) having an open state, in which the voltage supply line (C) is not electrically connected to the pixel electrode (104), and a closed state, in which the voltage supply line (C) is electrically connected to the pixel electrode (104).
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Citations
18 Claims
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1. A process for forming a backplane for an electro-optic display, the process comprising:
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providing a substrate; forming spaced first, second and third electrodes on the substrate; thereafter forming a sacrificial layer on the substrate, the sacrificial layer covering the first and second electrodes but leaving at least part of the third electrode exposed; thereafter depositing conductive material on to the substrate so as to form a cantilever beam member having a first section contacting the exposed part of the third electrode, and a second section extending over the sacrificial layer so as to extend over at least part of each of the second and first electrodes; and thereafter removing the sacrificial layer, thereby leaving the second section of the cantilever beam member free to into and out of contact with the first electrode under the influence of a voltage applied to the second electrode. - View Dependent Claims (2, 3)
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4. A process for forming at least one electronic component of an electronic circuit on a substrate, the process comprising:
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forming on the substrate a layer of a component material which can form the at least one electronic component; forming a layer of an embossable material over the layer of component material; imagewise embossing the layer of embossable material to form at least one first portion and at least one second portion having a greater thickness than that of the at least one first portion; etching the embossable material to remove the at least one first portion thereof while leaving embossable material present in the at least one second portion thereof, thereby exposing the component material underlying the at least one first portion of the embossable material; thereafter etching the exposed portions of the component material, thereby patterning the layer of component material and forming the at least one electronic component therein. - View Dependent Claims (5, 6, 7, 8, 9, 10, 11, 12)
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13. A backplane for an electro-optic display, the backplane comprising:
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a substrate; a transistor disposed on the substrate; a passivation layer covering the transistor; a pixel electrode disposed on the opposed side of the passivation layer from the transistor; and a conductive via passing through the passivation layer and electrically connecting the transistor to the pixel electrode, wherein the passivation layer comprises a polymer selected from the group consisting of epoxy, polyurethane, silicon, polyacrylate and polyimide polymers. - View Dependent Claims (14, 15, 16, 18)
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17. A backplane according to claim 27 wherein the substrate comprises a stainless steel foil covered with a polyimide insulating layer.
Specification