Microelectronic assembly with multi-layer support structure

• US 20080165519A1
• Filed: 01/05/2007
• Published: 07/10/2008
• Est. Priority Date: 01/05/2007
• Status: Active Grant

• Current Assignee: Adeia Semiconductor Technologies LLC (f/k/a Invensas Corporation) (Adeia Inc.)
• Original Assignee: Tessera, Inc. (Adeia Inc.)
• Inventors: Humpston, Giles, Nystrom, Michael J.
• Granted Patent: US 8,604,605 B2
• Time in Patent Office: Days
• US Class Current: 361/807
• CPC Class Codes: H01B 13/00 Apparatus or processes specially adapted for manufacturing conductors or cables
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: Y10T 156/1062 Prior to assembly
• CPC Class Codes: Y10T 156/1092 All laminae planar and face to face
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.

Claims

1. A method of forming a microelectronic assembly, the method comprising:

positioning a support structure adjacent to an active region of a device but not extending onto the active region,

wherein the support structure has planar sections, each planar section having a substantially uniform composition, and

wherein the composition of at least one of the planar sections differs from the composition of at least one of the other planar sections;

positioning a lid in contact with the support structure and extending over the active region; and

bonding the support structure to the device and to the lid.

2. The method of claim 1 wherein the planar sections comprise:

first and second adhesive layers coupled to the device and to the lid, respectively, and;

a structural layer between the first and second adhesive layers, wherein the structural layer is adapted to resist deformation under environmental conditions associated with bonding the first adhesive layer to the device and the second adhesive layer to the lid,

the method further comprising;

exposing the first and second adhesive layers to environmental conditions to cause the first and second adhesive layers to bond to the device and lid, respectively.

3. The method of claim 2 wherein exposing the first and second adhesive layers to the environmental conditions comprises exposing the first and second adhesive layers to a temperature and a pressure to cause the first and second adhesive layers to bond to the device and to the lid, respectively.

4. The method of claim 2 wherein an edge of the structural layer borders the active region of the device, the method further comprising:

while exposing the first and second adhesive layers to the environmental conditions, resisting deformation of the structural layer over the active region.

5. The method of claim 1 further comprising forming a support structure, wherein forming the support structure comprises:

forming a multi-layered sheet of support structure material; and

punching the sheet to define an aperture having one or more side walls adapted to border the active region.

6. The method of claim 5 wherein forming the multi-layered sheet of support structure material comprises:

providing a structural layer having a first side and a second side, opposite the first side;

adhering a first adhesive layer to the first side of the structural layer; and

adhering a second adhesive layer to the second side of the structural layer.

7. The method of claim 5 wherein forming the multi-layered sheet of support structure material comprises:

providing a sheet of material adapted to resist deformation under environmental conditions associated with bonding an adhesive material;

forming a plurality of pores in opposite surfaces of the support structure; and

coating the porous surfaces with an adhesive material that seeps at least partially into the pores.

8. The method of claim 5 wherein forming the multi-layered sheet of support structure material further comprises:

providing an adhesive material; and

partially curing the adhesive material to define a section of the support structure adapted to resist deformation under environmental conditions associated with fully curing the adhesive material.

9. The method of claim 8 wherein the section of the support structure is approximately midway between the device and the lid.

10. The method of claim 5 wherein positioning the support structure comprising aligning the aperture so that the one or more side walls border the active region.

11. The method of claim 1 wherein the change in composition between the at least one planar section that differs from the composition of the at least one other planar sections is gradual.

12. The method of claim 1 further comprising:

formulating the first adhesive layer with a first chemical makeup to facilitate bonding to the device; and

formulating the second adhesive layer with a second chemical makeup that is different than the first chemical makeup to facilitate bonding to the lid.

13. The method of claim 1 wherein the planar sections comprise:

first and second structural layers coupled to the device and the lid, respectively; and

an adhesive layer between the first and second structural layers,

wherein the first and second structural layers are adapted to resist deformation under environmental conditions suitable for bonding the first adhesive layer to the first and second structural layers,

the method further comprising;

exposing the adhesive layer to the environmental conditions suitable for bonding the adhesive layer.

14. The method of claim 1 wherein the active region is populated with one or more microelectronic devices.

15. The method of claim 14 wherein the one or more microelectronic devices comprise one or more optical devices, and

wherein the lid is substantially transparent to electromagnetic radiation at wavelengths that are relevant to the one or more optical devices.

16. The method of claim 15 wherein the planar sections comprise at least one layer that is substantially opaque to radiation at a wavelength relevant to the one or more optical devices.

17. The method of claim 16 wherein the at least one substantially opaque layer is substantially non-reflective to the relevant wavelength.

18. The method of claim 1 wherein the lid is glass.

19. A microelectronic assembly comprising:

a device having an active region;

a support structure adjacent to the active region but not extending onto the active region; and

a lid in contact with the support structure and extending over the active region,

wherein the support structure has planar sections, each planar section having a substantially uniform composition, and

wherein the composition of at least one of the planar sections differs from the composition of at least one other of the other planar sections.

20. The microelectronic assembly of claim 19 wherein the planar sections comprise:

first and second adhesive layers coupled to the device and to the lid, respectively, and;

a structural layer between the first and second adhesive layers,

wherein the structural layer is adapted to resist deformation under environmental conditions that are suitable to bond the first adhesive layer to the device and the second adhesive layer to the lid.

21. The microelectronic assembly of claim 20 wherein the environmental conditions comprise a pressure and a temperature suitable to bond the first adhesive layer to the device and the second adhesive layer to the lid.

22. The microelectronic assembly of claim 20 wherein the first and second adhesive layers are specifically formulated to facilitate bonding to the device and to the lid, respectively.

23. The microelectronic assembly of claim 20 wherein the structural layer is substantially opaque.

24. The microelectronic assembly of claim 19 wherein the planar sections comprise:

first and second structural layers respectively coupled to the device and to the lid;

an adhesive layer positioned between the first and second structural layers,

wherein the first and second structural layers are adapted to resist deformation under environmental conditions that are suitable for bonding the adhesive layer to the first and second structural layers.

25. The microelectronic assembly of claim 19 wherein the active region is populated with one or more microelectronic devices.

26. The microelectronic assembly of claim 25 wherein the one or more microelectronic devices comprise one or more optical devices, and

wherein the lid is substantially transparent to electromagnetic radiation at a wavelength that is relevant to the one or more optical devices.

27. The microelectronic assembly of claim 26 wherein the lid is glass.

28. The microelectronic assembly of claim 26 wherein at least one of the planar sections is substantially opaque at a wavelength that is relevant to the one or more optical devices.