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Microelectronic assembly with multi-layer support structure

  • US 20080165519A1
  • Filed: 01/05/2007
  • Published: 07/10/2008
  • Est. Priority Date: 01/05/2007
  • Status: Active Grant
First Claim
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1. A method of forming a microelectronic assembly, the method comprising:

  • positioning a support structure adjacent to an active region of a device but not extending onto the active region,wherein the support structure has planar sections, each planar section having a substantially uniform composition, andwherein the composition of at least one of the planar sections differs from the composition of at least one of the other planar sections;

    positioning a lid in contact with the support structure and extending over the active region; and

    bonding the support structure to the device and to the lid.

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