Carrier For Double-Side Polishing Apparatus, Double-Side Polishing Apparatus And Double-Side Polishing Method Using The Same

• US 20080166952A1
• Filed: 02/20/2006
• Published: 07/10/2008
• Est. Priority Date: 02/25/2005
• Status: Abandoned Application

• Current Assignee: Shin-Etsu Handotai Co., Ltd. (Shin-Etsu Chemical Company Limited)
• Original Assignee: Shin-Etsu Handotai Co., Ltd. (Shin-Etsu Chemical Company Limited)
• Inventors: Ueno, Junichi
• Application Number:
  US11/883,766
• Publication Number:
  US 20080166952A1
• Time in Patent Office: Days
• US Class Current: 451/41
• CPC Class Codes: B24B 37/28 for double side lapping of plane surfaces

Abstract

The present invention is a carrier for a double-side polishing apparatus in which, in a double-side polishing apparatus, the carrier is set between upper and lower turn tables to which polishing pads are attached, and a holding hole to hold a wafer sandwiched between the upper and lower turn tables in polishing is formed in the carrier, wherein the carrier is made of titanium. Thereby, there is provided a carrier for a double-side polishing apparatus in which the strength of the carrier itself is high, and at the same time, contamination of a wafer such as a silicon wafer by impurities is suppressed, and sag in a peripheral portion of the wafer after being polished is suppressed.

Claims

1. A carrier for a double-side polishing apparatus in which, in a double-side polishing apparatus, the carrier is set between upper and lower turn tables to which polishing pads are attached, and a holding hole to hold a wafer sandwiched between the upper and lower turn tables in polishing is formed in the carrier, wherein the carrier is made of titanium.

2. The carrier for a double-side polishing apparatus according to claim 1, wherein a surface of the carrier is coated with either a titanium nitride film or a DLC film.

3. The carrier for a double-side polishing apparatus according to claim 2, wherein a thickness of the film is in the range of 0.3 μ

m to 5 μ

m.

4. The carrier for a double-side polishing apparatus according to claim 1, wherein the wafer sandwiched between the upper and lower turn tables is a semiconductor wafer.

7. The carrier for a double-side polishing apparatus according to claim 2, wherein the wafer sandwiched between the upper and lower turn tables is a semiconductor wafer.

8. The carrier for a double-side polishing apparatus according to claim 3, wherein the wafer sandwiched between the upper and lower turn tables is a semiconductor wafer.

9. A double-side polishing apparatus comprising, at least, the carrier for a double-side polishing apparatus according to claim 1.

10. A double-side polishing apparatus comprising, at least, the carrier for a double-side polishing apparatus according to claim 2.

11. A double-side polishing apparatus comprising, at least, the carrier for a double-side polishing apparatus according to claim 3.

12. A double-side polishing apparatus comprising, at least, the carrier for a double-side polishing apparatus according to claim 4.

13. A double-side polishing apparatus comprising, at least, the carrier for a double-side polishing apparatus according to claim 7.

14. A double-side polishing apparatus comprising, at least, the carrier for a double-side polishing apparatus according to claim 8.

15. A method for polishing both sides of a wafer, wherein the carrier according to claim 1 is set between the upper and lower turn tables to which the polishing pads are attached, and the wafer is held in the holding hole formed in the carrier, then both sides of the wafer are polished with the wafer sandwiched between the upper and lower turn tables.

16. A method for polishing both sides of a wafer, wherein the carrier according to claim 2 is set between the upper and lower turn tables to which the polishing pads are attached, and the wafer is held in the holding hole formed in the carrier, then both sides of the wafer are polished with the wafer sandwiched between the upper and lower turn tables.

17. A method for polishing both sides of a wafer, wherein the carrier according to claim 3 is set between the upper and lower turn tables to which the polishing pads are attached, and the wafer is held in the holding hole formed in the carrier, then both sides of the wafer are polished with the wafer sandwiched between the upper and lower turn tables.

18. A method for polishing both sides of a wafer, wherein the carrier according to claim 4 is set between the upper and lower turn tables to which the polishing pads are attached, and the wafer is held in the holding hole formed in the carrier, then both sides of the wafer are polished with the wafer sandwiched between the upper and lower turn tables.

19. A method for polishing both sides of a wafer, wherein the carrier according to claim 7 is set between the upper and lower turn tables to which the polishing pads are attached, and the wafer is held in the holding hole formed in the carrier, then both sides of the wafer are polished with the wafer sandwiched between the upper and lower turn tables.

20. A method for polishing both sides of a wafer, wherein the carrier according to claim 8 is set between the upper and lower turn tables to which the polishing pads are attached, and the wafer is held in the holding hole formed in the carrier, then both sides of the wafer are polished with the wafer sandwiched between the upper and lower turn tables.

5-6. -6. (canceled)